On January 2, 2024, it was recently learned that Hefei Kangxinwei Storage Technology announced the completion of more than 100 million yuan in Series A+ financing. This round of financing was jointly participated by China Securities Construction Investment, Huaan Jiaye, Soochow Venture Capital, Bozhong Xinhe, Haiyue Capital, Zhuoyuan Capital, etc. It is reported that this round of financing funds will be mainly used for new product development and R&D team expansion.
Founded in November 2018, Kangxinwei is one of the few manufacturers in China that can independently design a full range of embedded storage master control chips, with the research and development of high-end storage main control chips and storage modules as its main business. The products cover consumer, industrial and vehicle standards, and can be widely used in smart TVs, set-top boxes, mobile devices, smart wearable devices, communication equipment, navigation equipment, drones, industrial robots, new energy vehicles, autonomous driving and other fields.
In addition to introducing top R&D equipment to consolidate the technical foundation, Kangxinwei has introduced the world's top R&D team, and the products developed by the key members of the team have been widely adopted by leading companies such as Intel, Samsung, Kingston, etc., and the team has the hard power to integrate with international manufacturers. Hefei Kangxinwei has recruited a management team with educational backgrounds and rich industry experience such as Stanford, China Europe Business School, Fudan University, University of Science and Technology of China, etc., and has established a "inclusive, pragmatic, enterprising" core-oriented operation and management system and a corporate culture of "creating excellence and achieving dreams". The products developed by Hefei Kangxinwei are mainly flash memory control chips, such as high-end EMMC, UFS and PCIe SSD products. The company's products are widely used in TVs, set-top boxes, mobile phones, data centers, cloud storage, servers, unmanned aircraft, automotive electronics, aerospace technology, smart cities, artificial intelligence and other fields.