Following the last launch of the C1 series of UDIMM memory modules, Chemclin recently released the new C2 series of industrial-grade DDR4 UDIMM memory modules. This product not only has high quality and reliability, but also has achieved national production, and at the same time adopts advanced technologies such as anti-sulfur technology and 30 gold finger gold plating thickness.
Kemei C2 series industrial-grade DDR4 UDIMM memory modules use high-quality CMXT Changxin A Die chips with a frequency of 2666, which has the advantages of high-speed data transmission, stable performance and low power consumption. At the same time, the product is JEDEC compliant and features a DDR4 DRAM FBGA component design to ensure superior performance and reliability. In addition, this series of memory modules has a gold finger plating thickness of 30, introduces anti-sulfur technology, has a capacity of 8GB, weighs 18G (without heat sink) or 37G (with heat sink), and has obtained CE, FCC, ROHS certification. Tested for our rigorous performance and reliability, this module can withstand harsh operating conditions and work stably in a wide temperature range of room temperature (0 70 ) and wide temperature range (-40 + 85 ).
This series of memory modules has achieved penetration through the national production. This product is equipped with the latest DDR4 memory chip of Changxin (CMXT), which is independently and controllable in China, and has achieved 100% national production. This national production not only ensures the reliability of the product, but also provides better support for domestic industrial applications.
In order to ensure that DDR4 UDIMM memory modules can operate stably in various temperature environments, we have carried out rigorous high and low temperature repeated tests on the finished product to ensure that the product can work stably in the temperature range of room temperature (0 70) and wide temperature (-40 +85) without fear of outdoor temperature difference between day and night and seasonal changes.
In order to ensure that DDR4 UDIMM memory modules can operate stably in various harsh environments, especially during use, their components are susceptible to corrosion by sulfur-containing components in the air, and during long-term use, this sulfide can cause components to fail, resulting in abnormal or even non-working of memory modules.
To solve this problem, we have also introduced anti-sulfur technology. This technology can significantly reduce the corrosion of components by sulfur-containing components in the air, thereby reducing the probability of failure and improving the long-term stability and reliability of the product.
In order to protect industrial applications from long-term operation, air pollution, humidity and temperature changes, dust, vibration, chemical corrosion and other external interference, this series of memory modules uses 30 gold finger gold plating thickness technology. This technology can provide excellent electrical conductivity, effectively prevent oxidation, wear and chemical reactions, significantly reduce the probability of failure caused by plugging or wet environment, and ensure that the signal or command of industrial control equipment can be transmitted stably and reliably under various harsh conditions.
This series of memory modules can withstand harsh environments, and can work normally in extreme environments such as moisture, vibration, pollution, corrosion, etc., ensuring the stability and reliability of industrial control equipment.
This series of memory modules has a wide range of compatibility, which can be compatible with domestic processor platforms such as Feiteng and Loongson, and can also be adapted to domestic software such as Galaxy Kirin and UnionTech, providing users with more flexible choices.
This series of memory modules is available in two versions with and without a heatsink for users to choose from. The version with heat sink can better dissipate heat and maintain the stability of the memory module during high-load operation; The version without a heat sink is lighter and suitable for applications where weight is critical.
In general, this series of memory modules has achieved advanced technologies such as domestic production, wide temperature resistance, anti-sulfur and 30 gold finger gold plating thickness, and has the advantages of wide compatibility, high reliability and high stability. It is especially suitable for edge servers, information innovation, 5G communications, electric power, network security, surveillance systems, factory automation, and transportation.