With the continuous development of microelectronics manufacturing technology, the performance requirements for materials are getting higher and higher. Among them, the coefficient of thermal expansion is a very important parameter, which directly affects the thermal stability and reliability of the material. Therefore, the application of thermal dilatometer in microelectronics manufacturing is of great significance.
For microelectronics manufacturing, the magnitude of the thermal expansion coefficient of the material is directly related to its stability and reliability in different temperature environments. For example, in the manufacturing process of semiconductor chips, if the coefficient of thermal expansion of the material is too large, it will cause the chip to deform and crack, which will affect its performance and service life. Therefore, accurate measurement of the coefficient of thermal expansion of materials is essential for microelectronics manufacturing.
At present, the commonly used methods for determining the coefficient of thermal expansion mainly include the ** method, laser interferometry, and quartz crystal microbalance. Among them, the ** method is a simple and easy method, which is suitable for the measurement of most solid materials;Laser interferometry is a high-precision method suitable for the measurement of tiny objects;Quartz crystal microbalances are a non-contact method for measuring ultra-thin materials such as thin films. Different measurement methods have their own advantages and disadvantages and scope of application, and it is necessary to choose the appropriate method for measurement according to the specific situation.
In addition to the above-mentioned common measurement methods, some new technologies for determining the coefficient of thermal expansion have also emerged in recent years, such as nanomechanical balances, atomic force microscopy, etc. The emergence of these new technologies provides more accurate and reliable data support for microelectronics manufacturing.
The application of thermal dilatometer in microelectronics manufacturing is of great significance. By accurately measuring the coefficient of thermal expansion of materials, it is possible to provide a scientific basis for microelectronics manufacturing, thereby improving their performance and range of applications.