Leju Finance Wu WentingOn January 2, it was reported that Shenzhen Hemei Jingyi Semiconductor Technology Co., Ltd. *** hereinafter referred to as "Hemei Jingyi") recently disclosed its initial public offering** and listed on the Science and Technology Innovation Board.
According to the prospectus of Leju Finance's "Pre-trial IPO", from 2020 to 2022 and the first half of 2023, Hemei Jingyi's operating income will be 18.9 billion yuan, 25.4 billion yuan, 31.2 billion yuan, 16.2 billion yuan;The net profit attributable to owners of the parent company was 3687130,000 yuan, 1924700,000 yuan, 2932360,000 yuan, 1520970,000 yuan.
In terms of regional distribution, from 2020 to 2022 and the first half of 2023, the company's revenue from South China will be 14.8 billion yuan, 15.5 billion yuan, 20.9 billion yuan, 11.2 billion yuan, accounting for respectively. 55%。
In this IPO, Hemei Jingyi plans to raise 800 million yuan, of which 600 million yuan will be used for the construction project of Zhuhai Fushan IC substrate production base (phase I), and 200 million yuan will be used to supplement working capital.
Hemei Jingyi focuses on the field of IC packaging substrates, and is engaged in the research and development, production and sales of IC packaging substrates. The company was established in 2007 with a registered capital of about 17.7 billion yuan, the legal representative is Yue Changlai.
In terms of equity, the controlling shareholder and actual controller of the Company is Yue Changlai, and as of the date of signing this prospectus, Yue Changlai holds 4,896 shares of the Company760,000 shares, accounting for 27 of the company's total share capital59%。It signed a concerted action agreement with Zhu Shengfeng, Ju Yongming, and He Fuquan to control a total of 39 companies98% of the voting shares.