Siemens AG has signed a memorandum of understanding (MOU) with Intel Corporation, one of the world's largest semiconductor companies, to work together to promote digitalization and sustainability in microelectronics manufacturing. The two companies will focus on advancing the future of manufacturing, developing factory operations and cybersecurity, and supporting the creation of a resilient global industrial ecosystem.
Semiconductors are the lifeblood of the modern economy. Nothing can run without chips. That's why we're proud to partner with Intel to fast-track semiconductor production." "Cedrik Neike, CEO of Digital Industries at Siemens AG and member of the Management Board of Siemens AG, said:"Siemens will bring its entire cutting-edge portfolio of IoT hardware, software, and electrical devices to the collaboration. "Together, we will contribute to the achievement of the global Sustainable Development Goals. "
The MoU identifies key areas of cooperation to explore various initiatives, including optimizing energy management and addressing carbon footprint issues across the value chain. For example, the collaboration will explore the use of complex, highly capital-intensive manufacturing facilities"Digital twins"to standardize the solution.
The collaboration will also explore minimizing energy use through advanced modelling of natural resource and environmental footprints across the value chain. To gain more information on product-related emissions, Intel will work with Siemens to explore product- and chain-related modeling solutions to drive data-driven insights that can help the industry accelerate progress toward reducing its collective footprint.
Keyvan Esfarjani, Intel's executive vice president and global chief operating officer, said:"The world needs a more globally balanced, sustainable and resilient semiconductor ** chain to meet the growing demand for chips. "We are excited to expand our collaboration with Siemens to build on Intel's advanced manufacturing capabilities and break new ground by leveraging Siemens' portfolio of automation solutions to improve the efficiency and sustainability of semiconductor infrastructure, facilities, and factory operations." The MoU will benefit regional and global industrial value chains. "
Siemens and Intel will combine their strengths and expertise to deliver sustainable practices across the entire semiconductor lifecycle, including design, manufacturing, operations, efficiency and, more importantly, critical to meeting the growing demand for powerful, sustainable chips. Technology has the power to accelerate solutions to reduce the climate impact associated with computing across the technology industry and other areas of the global economy. Automation and digitalization are key to meeting the challenges as the industry strives to achieve net-zero greenhouse gas emissions.