As an important automotive component, ICs are a key area of continuous attention for the AEC Committee. The reliability test of AEC-Q100 for ICs can be subdivided into accelerated environmental stress reliability, accelerated life simulation reliability, packaging reliability, wafer process reliability, electrical parameter verification, defect screening, and package integrity testing, and the test conditions need to be selected according to the temperature level that the device can withstand. It should be noted that it is difficult for third parties to complete AEC-Q100 verification independently.
AEC (Automotive Electronics Council) - Automotive Electronics Council, jointly initiated by the three major automobile companies in the United States (Chrysler Ford GM) and founded in 1994, has members distributed in car manufacturers, automotive electronic module factories and component manufacturers around the world.
AEC Q100 is a comprehensive reliability test and certification standard for automotive IC chips formulated by the AEC Committee based on the failure mechanism, which is the basic threshold for chip products to be used in the automotive field. The first edition was released in 1995 and continued to be updated until the 2014 H version, which is the standard that is still in use today. The AEC Q100 standard is a necessary test item for chip products (according to the requirements of product type, package topography and sample quantity).
Applicable products: single IC, such as MCU chips, MPU chips, memory chips, computing chips, security chips, LED driver chips, power supply chips, operational amplifiers, comparators, analog chips for perception, communication chips, etc.
AEC-Q100 specification 7 categories of 41 tests.
Group A - Accelerated Environmental Stress Test (PC, THB, HAST, AC, UHST, TH, TC, PTC, HTSL) with a total of 6 tests.
Group B – Accelerated Life Cycle Simulation Tests (HTOL, ELFR, EDR) – 3 tests in total.
Group C – Package Assembly Integrity Test (WBS, WBP, SD, PD, SBS, LI) - 6 tests in total.
Group D - Chip Manufacturing Reliability Tests (EM, TDDB, HCI, NBTI, SM) - 5 tests in total.
Group E – electrical verification tests (TEST, FG, HBM MM, CDM, LU, ED, CHAR, EMC, SC, SER) - 11 tests in total.
Cohort F – Defect Screening Test (PAT, SBA) – 2 tests in total.
Group G – Cavity Package Integrity Testing (MS, VFV, CA, GFL, DROP, LT, DS, IWV) - 8 tests in total.
AEC-Q100 Validation Process.
Test items. 
Key electronic components performance and life testing equipment.
Delta Delta Instruments specializes in the R&D and manufacturing of key electronic component performance and life testing equipment, and meets the requirements of some automotive electronic AEC-Q series standard certification testing equipment.
The series of products are used in various plug power cords, wire assemblies, interconnection wire assemblies, appliance input sockets, appliance output sockets, appliance sockets, capacitors (X capacitors, Y capacitors), isolation resistors (cross-line resistors), transformers, transformers for switching power supplies, photocouplers, power switches, relays, fuses, thermal fuses, fuse resistors, potentiometers, timers, thermostats, temperature limiters, thermal protectors, Electrical controllers, water level switches, rotary switches, sensors, printed circuit boards, varistors, motors, thermistors, etc. are tested for mechanical strength test, rated voltage test, rated current test, breaking capacity test, load characteristic test, heat (temperature rise) test, normal operation test, life reliability test, mechanical durability test and other test items.
Provide a complete set of testing instruments for the testing of electronic components, and can provide professional instruments and equipment for the following inspection and testing items for various electronic and electrical appliance manufacturers: integrated circuit testing: finished product testing, aging screening, failure analysis, etc.;Destructive Physical Analysis: External Visual Inspection, X-Ray Inspection, Particle Noise (PinD) Test, Tightness Test, Internal Gas Composition Analysis, Internal Visual Inspection, Internal Lead Bonding Strength, SEM, Chip Shear Strength;Reliability life and aging screening: aging screening test, steady state life test, accelerated life test, reliability enhancement test;Environmental test: sinusoidal vibration, random vibration, mechanical shock, collision (or continuous impact), constant acceleration, drop, dynamic monitoring of the output point, temperature-vibration-damp heat three stress test, high and low temperature and low pressure, temperature cycle, thermal shock, humidity resistance, high-pressure cooking, salt spray or circulating salt spray, mold, rain, gas corrosion, dust, thermal vacuum, strong acceleration steady-state damp heat (HAST);Physical test: physical size, solvent resistance, lead end strength, weldability, welding heat resistance, capping torque, coating thickness, flame retardancy test.