In the electronic component placement industry, carrier tapes play an indispensable role, as a carrier and protection tool for electronic components, they play a vital role in the entire production process. Recently, we have received a number of inquiries from our customers regarding the performance of carrier tapes during the placement process, especially the regulation of peel forces. In order to ensure a smooth placement process, as well as the safety and reliability of electronic components during transportation, it is important to have a comprehensive and accurate evaluation of the performance of the carrier tape.
On the premise of ensuring the normal function of the carrier tape, the reasonable regulation of the peeling force is particularly important. Peeling too little may cause the product to come loose during shipping, resulting in damage or scattering;However, excessive peeling force may cause peeling difficulties in the production line and affect the overall production efficiency.
Therefore, in order to meet the needs of customers, this article has in-depth understanding of the principles, test methods and practical application of the test results of the carrier tape peel force test. Through scientific and reliable mechanical testing, we provide better and more efficient production solutions for the electronic component placement industry.
First, the test principle.
The principle of the 180-degree peel test is to evaluate the adhesion strength of a material by applying a peel force on the surface of the carrier tape, aiming to determine the bond quality between the carrier tape and the adhesive layer and its performance under different conditions.
2. Test relevant standards.
ASTM D3330 D3330M - American Society for Testing and Materials (ASTM) standard for evaluating peel adhesion properties of pressure-sensitive tapes.
ISO 29862:2019 - International Organization for Standardization (ISO) standard for determining peel adhesion properties of adhesives in bonded components.
3. Test instruments.
1. Electronic tensile testing machine.
2. Peel off the fixture.
3. Test conditions.
Sample name: LED taping.
Test Type: Stripping.
Test speed: 300mm min
Test temperature: room temperature.
Fourth, the test process.
Step 1: Preparation.
Prepare the test equipment and make sure that the electronic tensile testing machine is in working order.
Select a 180° peel angle for the LED taping test.
Cut the appropriate size LED tape sample to ensure that the adhesive surface corresponds to the tensile surface at the selected peel angle.
Make sure that the surface of a long steel plate is flat and clean, and the total length of the sample is 300mm.
Step 2: 180° peel test.
Bond the adhesive surface of the LED tape to the surface of the steel plate.
Use 4The 5lb rollers fully compact the LED tape to ensure a good bond.
The bonded LED tape and steel plate are placed for a period of time to let it stand to ensure that the bond between the LED tape and the substrate is fully stable.
Install the 180° peel grip on the electronic tensile testing machine.
Place the LED taped sample fixed on the steel plate on the lower fixture, making sure that the sample is aligned with the fixture.
Use the upper gripper to secure the other end of the sample so that the LED tape is pulled up at 180° from the stretch surface.
Set the speed of the peel tester to 300mm min.
Start the testing machine and start the LED taping at the set speed. During the peeling process, the testing machine records data on the peeling force and the peeling distance.
Step 3: Data Logging.
After completing the test, the maximum peel force during the peel process, as well as the average peel distance, are recorded.
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