Semiconductor silicon epitaxial wafers are the key materials for the production of power devices such as MOSFETs and IGBTs and analog devices such as PMIC and CMOS. At the same time, the semiconductor silicon wafer industry is a fundamental part of the semiconductor industry chain, and it is also a link with a large gap between China's semiconductor industry chain and the international advanced level.
As one of the earliest companies in China to carry out the industrialization of semiconductor silicon epitaxial wafers, the company is also one of the few companies in China with integrated semiconductor silicon epitaxial wafer manufacturing capabilities, and adheres to the development strategy of becoming the world's leading manufacturer of integrated semiconductor silicon epitaxial wafers. The company will continue to increase R&D investment in crystal growth, substrate forming and epitaxial growth processes and continue to expand production capacity, further consolidate its leading edge in the field of large-size semiconductor silicon epitaxial wafers, effectively improve the self-sufficiency of China's semiconductor silicon epitaxial wafers and the technical level of the industry, enhance the independent and controllable level of raw materials required for the development of China's semiconductor industry, and promote the development of China's semiconductor industry.
1. Basic information of the project
The total investment scale of the project is 18,856260,000 yuan, the main body of implementation is Shanghai Jingmeng. The construction content of this project mainly includes the purchase and installation of related equipment for the production of epitaxial wafers of various sizes. After the project is completed and put into operation, Shanghai Jingmeng will add an annual production capacity of about 180,000 pieces of 12-inch epitaxial wafers, about 60,000 pieces of 8-inch epitaxial wafers, and about 240,000 pieces of new 6-inch epitaxial wafers.
2. Project investment estimate
The total investment of this project is 18,856260,000 yuan, the specific investment is as follows:
The cost of the construction work is 665000,000 yuan;Equipment purchase cost 16,176960,000 yuan;Other construction expenses 1,014300,000 yuan;Bottom liquidity 1,000000,000 yuan;Total 18,856260,000 yuan.
3. Project schedule
The construction period of this project is 24 months.
4. Project approval and land use
The project has fulfilled the filing procedures, the details are as follows:
R&D and Industrialization Project of High-quality Epitaxial Wafers 2203-310118-04-02-758787 Qing Environmental Protection Xu Guan [2022] No. 78.
The project is located at No. 8228 Beiqing Highway and No. 48, District 2, Qingpu District, Shanghai, Xianghuaqiao Street, Qingpu District, Shanghai, and is located in the existing factory building of Shanghai Jingmeng, which does not involve newly acquired land or plant construction.
5. Environmental protection problems and solutions involved in the project
This project will generate exhaust gas, wastewater, solid waste and noise during the production process. The company will take prevention and control measures to ensure that the treated gas emissions can meet the requirements of the "Comprehensive Emission Standards for Air Pollutants", "Odor Pollutants Emission Standards" and other laws and regulations for emission standards
After the classified collection and treatment of wastewater, the discharge concentration of each pollutant can meet the requirements of the "Electronic Industry Water Pollutant Discharge Standard" (GB39731-2020) and other regulations for the discharge standard;Solid waste is collected by classification, general industrial solid waste is reasonably disposed of, and hazardous waste is entrusted to relevant units with hazardous waste business licenses for disposalThe company will produce in strict accordance with the "Environmental Noise Emission Standard for Industrial Enterprises" (GB12348-2008), and use low-noise equipment to reduce noise pollution.
6. The measures taken by the company to achieve the strategic goals and the implementation effect
In terms of the implementation of the integrated epitaxy strategy, in order to give full play to the company's technological advantages and meet the growing demand of the downstream market, the company implemented the epitaxial wafer production capacity expansion project and continued to expand the epitaxial wafer production capacity. As of the end of 2021, the company's annual production capacity of 8-inch epitaxial wafers was about 3.2 million pieces.
At the same time, the company has invested in the construction of substrate-related production lines to achieve independent epitaxial substrates, which has increased the company's epitaxial integration year by year. In terms of technology research and development, the company continued to increase investment in technology research and development, carried out product and technological innovation around crystal growth, substrate molding and epitaxial growth, and obtained a number of key core technologies and patent intellectual property rights, while driving the proportion of the company's R&D investment in operating income increased year by year during the reporting period.
In addition, in 2021, the company successfully achieved a technological breakthrough in the research and development of the 12-inch epitaxial growth process. In terms of customer markets, the company relies on its industry-leading core technology, excellent product performance and reliable product quality, and its main products cover world-renowned wafer foundries and power device IDM factories, including Huahong Hongli, SMIC, China Resources Micro, TSMC, PSMC, Vishay Semiconductor, Dahl, Texas Instruments, STMicroelectronics, Customer A and other industry leaders.
In addition, the company has been deeply engaged in the field of semiconductor silicon epitaxial wafers, established a high brand awareness and industry influence, and has been recognized as a national-level "specialized, special and new little giant" enterprise, "Shanghai science and technology little giant enterprise", and "specialized, special and new" small and medium-sized enterprises recognized by Shanghai and Zhengzhou City, and has won awards such as "Best Partner" and "Outstanding Cooperative Partner" issued by internationally renowned manufacturers such as TSMC, Huahong Grace, SMIC, and Dahl for many years.
Through the above measures, the company has integrated semiconductor silicon epitaxial wafer manufacturing related technology and production capacity. During the reporting period, the company's semiconductor silicon epitaxial wafer business generally maintained a growth trend, the profitability increased rapidly, and its products and technologies were highly recognized by customers.
7. Measures to be taken in future planning
In the future, the company will adhere to the integrated development strategy of semiconductor silicon epitaxial wafers, continue to focus on the development of semiconductor silicon epitaxial wafer business, actively carry out technology research and development, continuously launch products to meet customer needs, expand semiconductor silicon epitaxial wafer production capacity, and enhance the company's market position and competitive advantage.
(1) Continue to increase R&D investment and improve core technical capabilities
The company will continue to increase R&D investment, purchase R&D equipment, expand R&D team, keep up with market demand, and continuously improve the technical level of semiconductor silicon epitaxial wafer production. By continuously increasing R&D investment in crystal growth, substrate molding, epitaxial growth and other links, the company will continue to improve the technical level of the whole process of epitaxial wafer R&D and production, further consolidate the company's industry leading position in the field of semiconductor silicon epitaxial wafers, and improve product competitiveness. In addition, the company will also actively develop 12-inch semiconductor silicon epitaxial wafers to lay a solid foundation for the company's long-term development.
(2) Continue to increase product development and expand the production capacity of semiconductor silicon epitaxial wafers
The company will continue to be guided by market demand, closely track the latest technologies and development trends in its industry and subdivisions, combine the industry evolution of downstream application fields, and continue to increase the development of semiconductor silicon epitaxial wafer products with different specifications and parameters according to the customized needs of customers, so as to accurately meet customer needs. In addition, the company will continue to expand the production capacity of semiconductor silicon epitaxial wafers, further enhance the company's performance scale, enrich the product layout of semiconductor silicon epitaxial wafers, and enhance the company's product quality, so as to effectively enhance the company's industry status and core competitiveness.
(3) Continue to introduce and cultivate high-end talents and build a first-class team
The semiconductor wafer industry is a technology-intensive industry, and excellent talents are the core elements to continuously maintain the company's innovation ability and competitiveness. The R&D, production and sales of semiconductor silicon epitaxial wafers have high requirements for the company's employees' technology accumulation, R&D capabilities, production experience and business capabilities.
In order to enhance the company's competitive advantage and further consolidate the company's leading position in the industry, the company will actively introduce talents in production, management and sales, vigorously introduce high-end scientific research talents with rich experience in semiconductor silicon epitaxial wafer research and development, further expand the company's R&D personnel, strengthen the training of existing employees, improve the comprehensive quality level of all employees, improve the company's employee assessment and incentive mechanism, and lay a solid foundation for the company's long-term development.
(4) Continue to strengthen market expansion
The company will continue to cultivate key customers, consolidate long-term and stable good cooperative relations with key customers, further improve customer communication channels, strengthen the service ability to provide customized products and solutions for key customers, and continue to enhance the company's market position and brand in the field of semiconductor silicon epitaxial wafers. In addition, the company will actively explore customer resources such as major wafer foundries and power device IDM factories at home and abroad to further enhance the company's marketing service capabilities.