Loongson 3D5000 won the 2023 China IDC Industry Innovation Technology Product Award

Mondo Technology Updated on 2024-01-30

From December 12th to 14th, the 18th China IDC Industry Annual Ceremony (IDCC 2023) was grandly held. The theme of this forum is "Computing Power Evolution, Digital Creation", and the new development of the computing power industry and the new future of ecological construction. Loongson's 3D5000 chip stood out with its advantages in independent innovation and industrial empowerment and won the "2023 China IDC Industry Innovation Technology Product Award". It is also the only CPU product to win the award.

Loongson Zhongke said in the theme report of the main forum of the conference that at present, independent CPU products and ecology continue to mature, the cost-effective advantage has been significantly improved, the market scale is expanding, and a new pattern of industrial development is accelerating, and Loongson will become the preferred choice of intelligent computing chips.

During the forum, the compilation of "China's Intelligent Computing Industry Development 2024" initiated by the Data Center Committee of China Communications Industry Association was officially launched. The compilation unit includes a number of "Eastern Data and Western Computing" project-related units and representative enterprises, and Loongson Zhongke participated in the preparation and launching ceremony.

China's intelligent computing industry is ushering in a period of rapid development, and Loongson Zhongke will unswervingly conquer key core technologies and explore a new path from a policy-based market to an open market.

Related Pages