A relevant ** is attached at the end of the article
According to public information, HBM is a form of 3D DRAM, which uses TSV and micro-bump to vertically stack multiple DRAM chips, and connects to the GPU through a silicon interposer inside the package substrate, making it have the advantages of high bandwidth, high capacity, low power consumption, and low latency. The rise of large AI models has given rise to massive computing power requirements, and the increase in data processing capacity and transmission rate has made AI servers put forward higher requirements for chip memory capacity and transmission bandwidth, and HBM can meet the relevant requirements. Its advantages of high bandwidth, low power consumption, and small package size make it expected to be more widely used in mid-to-high-end GPUs in the AI era, and is expected to replace GDDR and become a mainstream solution.
As large manufacturers continue to reduce production and increase production reductions, the WAFER contract on the NAND side has appeared, which is expected to drive the repair of product spot products in the future. This change reveals the dynamics of the storage market and indicates that HBM memory chips may be about to usher in a new stage of development. At present, the demand for new technologies such as DDR5, HBM, and LPDDR5 in the DRAM market is relatively good, which is affected by factors such as the gradual increase in terminal penetration, the stimulation of AI demand, and the release of new mobile phone products. Especially in the field of AI and high-end computing, the high bandwidth, high capacity, and low latency characteristics of HBM memory chips make them an ideal choice. With the continuous development of AI technology and the continuous expansion of application scenarios, the market demand for HBM memory chips will continue to grow.
In addition, the gradual stabilization of NOR products above 128MB** indicates that the competitive landscape of the storage market may be about to change. With the continuous expansion of large manufacturers and the increasingly prominent demand for localization, it is expected that storage manufacturers will usher in multiple inflection points in terms of operation and pattern in the fourth quarter of 2023. In this context, global GPU chip giants such as Nvidia, AMD, Intel, etc. are actively queuing up to buy HBM memory chips, and are even willing to pay a premium of five times to grab them. This momentum will completely open up the imagination of HBM memory chips and promote them to become a new chapter in the technology of the future. Therefore, concept stocks such as "SK hynix" in the A** field may become the focus of market attention. The technology and market layout of these companies will directly affect the future development of HBM memory chips. For everyone, paying close attention to the dynamics and industry trends of these companies will help to grasp the operational opportunities in the HBM memory chip market.
In general, with the continuous changes and technological innovation of the storage market, HBM memory chips, as an emerging technology, will play an increasingly important role in the future. Judging from the current market trend, the development prospect of HBM memory chips is very broad, which deserves the continuous attention of everyone and the industry. According to TrendForce**, the global HBM bit supply is expected to grow by 105% in 2024, and the HBM market is expected to reach $8.9 billion by 2024, up 127% year-on-year. It is expected to exceed $10 billion by 2025.
HBM-related concepts**:
1. Shannon Xinchuang: The company has accumulated many high-quality original factory authorization qualifications, and has successively obtained the authorization rights of SK hynix, one of the world's top three memory manufacturers in the whole industry, MTK, the world's famous main control chip brand, and GigaDevice, a leading manufacturer in the field of domestic memory control chips, forming a first-class original line advantage.
2. GigaDevice: The company has launched the GD32A503 series of automotive MCU products, and has established long-term strategic cooperative relations with many leading Tier 1 manufacturers and OEMs in the industry.
3. Taiji Industry: Taiji Semiconductor has formed DRAM and NAND Flash from traditional packaging to advanced packaging, and almost all packaging forms are fully covered.
4. Jacques Technology: The leading semiconductor material platform in China, with mid-to-high-end EMC spherical packaging materials, spherical silicon powder for MUF, low-spherical silicon powder and other products, and the core supplier of SK hynix.
All the views mentioned in this article are only personal ideas, and the subject matter involved is not recommended, and you buy and sell it at your own risk.