Huawei once again disclosed a new semiconductor patent, revealing the progress of Kirin dual-core stacking
Kirin + 5G is considered stable!
Huawei's just-published patent, which was registered in September 2021, means that the reliability of the technology was verified two years ago.
Faced with the ban on advanced semiconductor manufacturing technology and back-end packaging technology, Huawei and even China's semiconductor manufacturing industry have to choose the main escape route.
The day before yesterday, Huawei released it"Semiconductor packaging"Invention patents. This patented solution reduces costs and provides efficient and reliable semiconductor package manufacturing.
This is equivalent to telling you that Huawei's current chip manufacturing has surpassed key technologies.
Do you remember?On November 26, 2021, Huawei announced a patent related to chip packaging technology, according to which Huawei started this chip packaging technology mainly to improve the heat dissipation efficiency of the chip, thereby improving the comprehensive performance of the chip.
The two patents together have reduced the cost of the Kirin chip, fixed the heat dissipation, increased the throughput rate, and improved the overall performance of the chip.
Remember what I said above, and in six months, you'll be saying:"And they really did"。
As we all know, Huawei's dual-core stacking technology can effectively partially bypass advanced lithography technology, in this scheme, a similar form has been implemented on Apple's M1Ultra, but Apple is making up for the gap between the two M1Max chips, which are relatively large and can only be used on the PC side, while Huawei has stacked two chips, which are better than Apple in terms of volume control, so that it is also easier to integrate into mobile phone terminals.
The dual-core stack, although the performance has been improved, but the shortcomings are also very obvious, that is, temperature control, cost, throughput and other problems, as Huawei's two patents published above have clearly told us, effective solutions.
Therefore, Huawei's patented technology for manufacturing two chips is born for dual-core stacking, which also means that there have been rumors in the industry that Huawei will break the news, through this public patented technology, it is equivalent to, the side confirms the relevant progress of Huawei Kirin, okay, I won't say anything superfluous, spring has come, and now it's spring, let's wait for Huawei's performance in the second half of the year!The return of the king, joy Huawei, joy of China's chip manufacturing industry.