In SMT (Surface Mount Technology), wave soldering is a commonly used soldering process used to connect electronic components and PCBs (Printed Circuit Board). Unlike reflow soldering, which melts solder paste in a high-temperature environment, wave soldering involves immersing the pads in a pool of molten solder and using wave crests to smoothly coat the pads.
The main roles of wave soldering include:
Achieve a solder connection: Wave soldering involves immersing the pad in a pool of solder, allowing the molten solder to cover the entire surface of the pad through wavy peaks. The solder creates an electrical connection between the component pins and the pads through thermal conduction, thus enabling the soldering connection between the component and the PCB.
Improved connection quality: Wave soldering ensures that the solder forms a uniform, continuous solder joint between the pad and component pins. The formation of solder joints ensures a reliable electrical connection between the electronic components and the PCB, helping to improve the reliability and vibration resistance of the connection.
Prevent overheating damage: Wave soldering helps with effective thermal management of electronic components. During the soldering process, the melting temperature and wave height of the solder pool can be precisely controlled to avoid overheating damage to the electronic components. At the same time, the post-soldering cooling process quickly cools the solder joints and reduces heat transfer to the components.
In conclusion, wave soldering plays an important role in SMT, ensuring a reliable connection between electronic components and PCBs, improving soldering quality and product reliability by achieving soldering connections, improving connection quality and preventing overheating damage.