Argon ion cutting is a sample surface preparation technique that uses a wide ion beam (1 mm) to cut a sample to obtain a wide and precise electron microscopic analysis area.
Mechanical grinding and polishing vs ion beam polishing.
Limited hard and solid samples are suitable for all types of samples.
o Hardness of metal materials o Soft and hard metal materials are acceptable.
oSilica and glass oThe same sample contains different materials of hard and soft.
o Semiconductors (aluminumWideHigh k dielectric o porous material.
o Minerals (dry) o Wet or oily samples: oil shale.
o Organics. The operator needs to periodically change the particle size of the polishing liquid, and the operator does not need to stare at it when using it.
Solder interface mechanical polishing results Solder interface ion beam processing results.
Mechanical grinding and polishing vs ion beam polishing.
AL 6061 Alloy Electropolishing VS Pecs II
Electropolishing:
pecs ii,step 1: 60 min, 5 kv, 5°,step 2: 8 h, 1 kv, 3°
Flat surface cleaning function.
Cleaning of the sample surface can be achieved by using planar ion grinding.
Technological advantages
1.Two focused ion guns, no consumables for the ion guns.
2.Multi-functional: ion beam plane + cross-section polishing + high-precision coating.
3.The polishing coating is in the same vacuum system, and the polishing can be directly coated after completion.
4.Polishing area: 10mm or more.
5.Fully automatic touch screen control, configuration mode operation, high repeatability of sample preparation.
6.A liquid nitrogen cooling station is provided as standard to remove damage to the sample caused by thermal effects.
7.Vacuum transfer system is available as an option.
PECS II etching polishing stage.
New touchscreen control system.
Screenshot of the touchscreen menu.
Coating options page.
Target selection: Two targets can be placed at the same time.
Polishing feature page.
Liquid nitrogen cooling table and temperature control system.
Liquid nitrogen cooling table. Flat polishing and loading system.
Flat polishing and loading operation.
Cross-sectional polishing loader.
Schematic diagram of plane etching and polishing Upward view.
Schematic diagram of cross-section etching and polishing.
3d ebsd with pecsii
140x120x4 microns3
3d ebsd with pecsii
The size of the polished area.
Ion sputtering. Ion beam coating.
cr coating（ibc vs magnetron）
ion beam cr coating magnetron cr coating
ion beam coating
xtem of multilayers of cr/c on a si substrate produced by ibc
htem image of a cross section through different coating layers (ibc) on si substrate.