On December 28th, it was hosted by Xunshi Company, an authority in the optical communication industry2023 First Suzhou Optoelectronic Technology Industry ForumSuccessfully held in Suzhou, this conference will focus on "Next-Generation Interconnection Technology Empowering AI Computing Power and Optical Network" and "Opportunities and Challenges for the Integrated Development of Optoelectronic Technology".Optical communications, semiconductorsand other business executives and experts from scientific research institutes to jointly develop the next generation of high-speed optoelectronics industry innovation opportunities.
As a provider of semiconductor advanced packaging automation equipment, Bozhon Semiconductor was invited to participate in the conference and relied on ".Xingwei series EH9721 automatic high-precision eutectic machine"The product stood out from a group of strong enterprises and was evaluated2023 ICC Xunshi Hero List Excellent Equipment Award
introduction
Product Introduction
Xingwei series EH9721 automatic high-precision eutectic machine is specially designed for Bozhon SemiconductorMulti-functional chip placement equipment developed and produced in the field of optical modules, full-stack self-developed. Placement accuracy 15 m@ 3, with eutectic SMD, dipping SMD and FLIP chip SMD functions, which can meet the needs of multi-chip placement. The modular design concept makes it have highly flexible manufacturing capabilities, equipped with intelligent calibration and data management systems, so that it has the ability of process traceability and management.
400g, 800g and 16T optical transceiver will gradually become the main product in the marketOptical modules have high speed, high bandwidth, low power consumption, and miniaturizationThe model is compatible with a variety of different packaging forms such as COC, COS, and Gold Box, and adopts a gantry structure with nano-level absolute double feedback, multi-nozzle (12) dynamic automatic replacement, and multiple transfer stations (8 x2"/4x4"The automatic loading and unloading mode of Gel Pack Waffle Pack and magazine buffer are combined with high-level software with complete functions and simple operation to meet the needs of customers for rapid mass production and high production capacity.
highlights
Product Highlights:
Ultra-high flexibility
The chip size is compatible with large sizes: 8 transfer stations (015*0.2mm-5*5mm）；The substrate size is compatible with large sizes: ultra-large working size (eutectic: 18*22mm;Bonding: 130*200mm);The packaging process is more complete:Coc Cos Gold Box eutectic process, AOC COB LENS die bonding process, Flip Chip flip chip process;More full feeding method: 2 6s"Wafer, 8 (2*4) gel-paks, support streamlined automatic width adjustment docking and loading and magazine loading system;Extra-large receiving size: 9 (3*3)gel-paks other custom clamps to support magazine receiving;
Ultra-high precision
Ultra-high fitting accuracy: Lamination comprehensive accuracy 15 m@ 3 (standard tablets);Ultra-high force control system: Pressure control accuracy 10-50g (2g), 50-300g (10%);Automatic calibration algorithms: Integrated automatic calibration module, automatic calibration system accuracy of equipment, reduce manual intervention and debugging;Advanced compensation technology: Integrated table-mapping two-dimensional compensation to ensure the comprehensive accuracy of the device;
Ultra-high speed
Gantry structure design: Gantry structure design to improve the operation efficiency and product compatibility of each axis;Advanced operation control system: High-performance ironless motor + carbon fiber structure design, transverse axis acceleration 25g 2m, gantry shaft acceleration 2g 15m；High-speed streamlined design: Variable speed streamline design, saving streamline conveying time;Multi-magazine cache design: Reduce the frequency of manual loading and unloading;
Winning this award is not only a recognition of the comprehensive strength of the product, but also an affirmation of the innovative research spirit of Bozhon Semiconductor. In the future, Bozhon Semiconductor will continueWith innovative products, technologies and solutions, to create unique value for the optical communication industry, and help optoelectronic packaging to a new level.