Rapid temperature change test and thermal shock test are both types of reliability environmental testing equipment, due to different product tests, so the equipment used will be different, there are some similarities between the two equipment, sometimes it may not be easy to distinguish, today Miki Technology will introduce to you what is the difference between these two equipment.
1. The purpose of the test is different.
The rapid temperature change test is suitable for the safety test of electronic components, in which the defects are exposed early to correct and improve its own performance, which is usually divided into linear rapid temperature change test and nonlinear fast temperature change test.
The thermal shock test uses the principle of thermal expansion and cold contraction to cause rapid changes in temperature under the physical or chemical destruction, while the more common thermal shock test has a two-box or three-box type.
2. Test stage.
Rapid temperature change test: in the mass production stage.
Thermal shock test: R&D and design stage.
3. The test products are different.
Rapid temperature change test: suitable for safety testing of electronic components.
Thermal shock test: suitable for composite materials and material structures.
4. The rate of temperature change is different.
The rapid temperature change test is to complete the temperature change within the specified time, that is, heating and cooling, which is divided into linear and nonlinear, and the temperature change is within the controllable range.
The thermal shock test is a rapid change in temperature, and the transformation speed is very fast, generally a conversion of temperature shock is completed within 5min.
You can choose the corresponding test equipment according to your specific needs, so that there will be no mistakes in the test process.