OneCommon PCB component placement considerations
Component spacing
When components are placed too close together, there will be automatic pick-and-place problems, which will adversely affect the test (fixture);
The components should not be too close to the edge of the PCB
Components are too close to the edge of the PCB, making it difficult for the PCB panel to separate into veneers;
The position and orientation of the wave soldering element
If the component is discrete, both pins enter the solder at the same time when the PCB is wave soldered. However, for larger components, it should not be placed in front of the larger components as shadows are generated.
IIPCB component placement skills
Do not place the integrated circuit too closely
It is recommended to leave at least between each integrated circuit of the PCB board0.35 inches to 05 inchesand leave more room for larger ICs. Placing the ICs too close together can result in limited space when routing the pins, wasting time rearranging the design.
Make sure that similar components are facing the same direction
Orienting similar components in the same direction makes it easy for subsequent personnel to install, inspect and test. Otherwise, the soldering process may be disrupted, resulting in some components not being soldered at all, and short circuits and open circuits on the PCB board.
Group components by function
Ensure that components are isolated according to the function blocks in the circuit. For example, power management components should not be mixed with analog components, and high-speed digital communication should remain separate. Plan where these components should be placed on the PCB and keep noisy signals away from highly sensitive signals. In addition, by grouping components based on function, you have more control over their return paths.
Place the edge components first
Placing edge components first facilitates the layout of the board where the input and output connections are connected. These parts are usually parts that cannot be moved due to the mechanical enclosure (e.g., connectors, switches, jacks, USB ports, etc.).
Positioning of high-frequency components
Avoid placing sensitive, high-speed devices close to the edge of the board, which has different impedance characteristics and a high chance of electromagnetic interference (EMI). Importantly, the connector to which the PCB is connected radiates EMI. Given these factors, sensitive, high-speed devices should be placed close to the center of the board to reduce the effects of EMI.
Place the heat dissipation element
The general rule states that the traces connecting the various components (resistors, capacitors, inductors, integrated devices, etc.) should be very short and close to the device. This is the right thing to do when operating mainly at high frequencies. However, minimizing the length of the connection can create thermal problems, resulting in uneven accumulation of local heat. In this case, parallel positioning of the components in the circuit and the heat pipes can be employed.
Do not overlap parts
Overlapping parts can cause short circuits due to current flowing between components.
Place parts on one layer as much as possible
Many designs require multilayer PCBs to accommodate weight and space constraints. However, if the part is placed on multiple layers, it is not possible to perform dual multi-channel due to welding process issues when the component is mounted, which can waste unnecessary expensive manufacturing costs.
Make room for copper traces
When placing components, make sure there is enough clearance for copper wires to pass through, especially near components with hundreds of pins.
Follow the schematic design
Placing components in logical groups on the PCB layout, as you would in schematic design, will save time and reduce trace lengths, as many of the components are already logically grouped according to the schematic.
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