What are the characteristics of CRCBOND UV glue when bonding CMOS chips?
Fast curing: UV glue should have the characteristics of fast curing to improve production efficiency.
Excellent optical performance: CMOS chips are widely used in optical sensors, so choose UV glue with excellent optical properties to maintain image quality and sensor sensitivity.
Low viscosity: CMOS chips usually work in high-temperature environments, so the UV glue selected should have low viscosity and be able to maintain stable bond strength at high temperatures.
Low ion content: CMOS chips are highly sensitive to ions, so choose UV glues with low ion content to reduce the impact on chip performance.
Chemical resistance: CMOS chips may be exposed to some chemicals, so the UV glue selected should have excellent chemical resistance to ensure the stability and durability of the bond. When selecting and using UV glue, it is necessary to comprehensively consider the specific CMOS chip size and material, the environmental requirements of the bonding application and other factors, and carry out relevant testing and verification to ensure that the bonding effect is reliable.
Wait a minute. Part of the information in this article is only for the purpose of sharing and exchanging new information in the industry, not for commercial use. If there is any right involved, please let us know as soon as possible, and we will delete it immediately, thank you.