The United States, Japan and the Netherlands have joined hands to make breakthroughs in three key technologies
It is reported that the United States, Japan and the Netherlands have reached a joint agreement involving ASML, Tokyo Electron, Nikon and other equipment product companies. From the perspective of the industrial chain, these agreements are not conducive to the development and progress of the industry.
But no matter what, go your own way. It is worth noting that the United States, Japan, and the Netherlands have just joined forces, and Chinese companies have three breakthroughs.
Chip manufacturing is inseparable from the support of globalization, and the United States has been unfavorable to the development of globalization over the years, and many first-class businessmen have been involved in it for no reason. The most representative is ASML from the Netherlands, which is the world's largest manufacturer of lithography machines, which can produce hundreds of lithography machines a year, and repeatedly set new sales records.
Originally, ASML could have achieved better results, but due to the interference of the United States, ASML could not help in many things.
Now, it is reported that the United States, the Netherlands and Japan have reached an agreement to redesign and ship equipment such as lithography systems, and ASML, Nikon, and Tokyo Electron have become the object of focused attention, such as ASML's DUV lithography machine has undergone adjustments.
ASML is certainly not willing to blindly follow the trend, and it has repeatedly warned that doing so will lead to the disruption of the global ** chain, and will also make customers lose the place to participate in self-inspection. In fact, if you think about it from a different angle, pressure can be transformed into motivation, and in all areas of life, in all fields of science and technology, it will give birth to a new look. In this regard, Chinese companies have made three breakthroughs.
First of all, the quantum chip production line was unveiled.
Compared with the mass consumer market, quantum chips are relatively unfamiliar, and the main chips in the industry are electronic chips. Quantum wafers, on the other hand, not only have specific application areas, but also have different manufacturing processes.
According to CCTV, the Chinese company Quantum Source is building the first quantum chip production line in China in Hefei, Anhui Province, to produce quantum chips in an orderly manner.
The quantum chip industry chain is gradually unfolding, and there is already an industrial software for quantum chip design in the domestic market, Q-EDA-Benyuan Kunyuan, which supports the design standards of superconducting and semiconductor quantum chips, which is a major boost to the development of the quantum chip industry. Now that the quantum wafer production line has been unveiled, it is believed that it can be applied to various fields to solve complex problems.
Second: China Telecom's progress in the localization of small base stations.
China's 5G technology has reached the world's leading level, with more than 2.2 million 5G base stations built, and the number of 5G network users ranks first in the world. In addition, Chinese companies such as Huawei and ZTE also rank first in the world in the number of 5G patent applications. A number of 5G technologies are constantly being optimized and improved.
This time, China Telecom brought good news, making a breakthrough in the localization of small base station PRRU, and the localization rate of chips and devices reached 100%.
PRRU is a miniaturized, low-power base station, which is mainly used in small public areas, and has great convenience advantages for expanding 5G signal coverage. China Telecom's breakthrough in 100% localization of PRRU base station components means that it will deepen the segmented deployment of 5G networks.
Third: a breakthrough in 3nm photonic chip transistors.
Photonic chips seem to have become a hot topic of chip innovation and development, and those who know know that the first photonic chip in China will be built this year. From the perspective of chip characteristics, photonic chips have higher transmission speed and lower power consumption than electronic chips. The requirements for advanced processing technology are not high, and the process of a few hundred nanometers is enough to meet the demand.
What's more, photonic chips are widely used in scenarios such as communications, data centers, and transportation. But to improve the performance of photonic chips, we must start with the process.
To this end, the Chinese Academy of Sciences announced a breakthrough in 3nm photonic chip transistor technology. The transistor of the chip is the channel of signal transmission, and the higher the density of the transistor, the stronger the performance, which can generally reach the 3 nanometer level, which shows that the transistor can accommodate the expansion of information has made a qualitative leap.
Soon, many parties have just joined hands, and Chinese companies have made breakthroughs in quantum chips, PRRU base stations, photonic chips, etc. These technical fields are close to developing and exploring an innovative direction, which is a future-oriented innovative research breakthrough.
The focus of multi-party cooperation is on traditional equipment products, and further subdivision and adjustment are made on the basis of existing advanced technology. For example, ARFI mode devices in the DUV deep ultraviolet light class.
However, not all chip industries rely on such lithography equipment, if we start from the aspects of new materials, new technologies, new processes and new architectures, cross-integrate various innovative processes, and give full play to the demand advantages of mature chips, then the corresponding development and utilization goals can also be achieved.
So, in general, we need to try more in combination with the unpredictable market environment.
There are many types of chips, and there is more than one path for industrial development, and if we can explore a better direction for future development, many things will become much easier. This requires the joint efforts of the industry, from chip design to manufacturing, to the packaging industry, there are a variety of innovative technologies, depending on how to apply.
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