TSMC unexpectedly, domestic 3nm chip technology breakthrough, foreign media strong opponents appeared
Four years ago, Huawei launched the 5nm Kirin 9000 process chip, which is the world's first 5nm mobile phone chip and the first 5nm chip to integrate the 5G network standard.
At this stage, the Kirin chip of the National Bank is on par with the Qualcomm chip, one step ahead of the MediaTek chip. In other words, Kirin chips have reached the world-class level in the 5nm process stage.
Four years have passed, Qualcomm, Apple and MediaTek have launched a variety of 4nm chips, Apple has launched a 3nm process A17 chip, Qualcomm has also launched a 3nm process Snapdragon 8Gen3, and MediaTek's 3nm process chip is also in the mass production stage.
In contrast, Huawei's Kirin chip process is still at the 5nm level, and has not entered the 4nm and 3nm categories. Although Huawei launched the Kirin 9000S chip at the end of August, Huawei did not disclose the process information of this chip. It is widely speculated in the industry that the process of this chip is between 7nm-14nm.
Of course, Huawei can still design 3nm and 4nm chips, but Huawei has been suppressed, and TSMC cannot OEM 4nm and 3nm chips for Huawei.
However, this situation has changed to a certain extent, although Chinese mainland companies have not been able to help Huawei integrate 4nm and 3nm chips, but in 3nm chip technology, Chinese mainland companies have made breakthroughs. In this regard, there are foreign ** claims:"Impressive opponents have emerged.
In the case of Guilun Electronics, the company has made breakthroughs in the 7nm, 5nm and 3nm wafer processing nodes, and has laid a solid foundation for the development of EDA tools for 3nm wafers.
Another company, Hongxin Micro-Nano, also said: Last year, it broke through the 5nm processing node and achieved a technological breakthrough in the 3nm processing node.
Huada Jiutian, a well-known chip company in the mainland, stated that it has achieved a change from 0Technological breakthroughs in the 35um to 3nm processing nodes, with products covering digital, mixed-signal, RF and other fields.
It is not difficult to see that in the field of 3-nanometer integrated circuit technology, Chinese mainland enterprises have also made a number of breakthroughs. Although these technologies cannot help Huawei integrate 3nm chips, it will lay a solid foundation for the R&D and design of Huawei's 3nm chips.
Perhaps TSMC did not expect that mainland companies would lack 3nm chip foundry technology, but it is really surprising that mainland companies are willing to spend energy to overcome 3nm process node technology.
At present, the mobile phone wafer manufacturing process has entered the 3nm era, although the mainland foundry enterprises cannot produce 3nm wafers, this does not mean that mainland enterprises will stop developing 3nm wafer technology.
Obviously, under the suppression of foreign-funded enterprises, Chinese mainland enterprises not only did not go bankrupt, but made technological breakthroughs in the 3nm process node, which shows that Chinese mainland enterprises have strong self-research capabilities. Because of this, foreign countries say that 3nm wafer technology and TSMC's strong opponents have emerged.