After the end of World War II, the United States began to attract top scientists to achieve scientific breakthroughs through various means. In recent years, the United States has been attracting top talents from around the world with slogans such as freedom, equality, and borderlessness, and has retained scientific research results through permanent jobs and huge subsidies. However, after the outbreak of the Sino-US chip war, the United States targeted TSMC, trying to attract TSMC to build factories in the United States by revising the rules and subsidizing tens of billions of yuan. Although Zhang Zhongmou did not approve at first, under coercion and inducement, TSMC had to slowly move talents, technology and equipment to the United States. At the factory opening ceremony, TSMC received the support of chip giants such as Apple, Nvidia and AMD, and Biden was also happy about it, believing that American manufacturing is back. However, as a result, TSMC's old American shareholders began to sell**, and the United States revised the subsidy rules, requiring TSMC to apply for subsidies, and at the same time handing over core business data, and not allowing expansion in China, the world's largest market. The latest news is that the United States has decided to invest $3 billion to fund the local chip packaging industry, which is the first R&D investment project under the CHIPS and Science Act. Why did the United States suddenly change its tune and put money into the packaging industry?This is because the packaging link plays an important role in the chip industry chain, and China's packaging capacity accounts for a large proportion, especially Changdian Technology has achieved the world's leading level in packaging. Therefore, the United States is afraid that Chinese companies will gain more benefits in the chip industry chain, and they are also worried that they will one day be stuck by Chinese companies. U.S. Deputy Secretary of Commerce Laurie Locasio said that by 2030, the United States will have a large number of advanced packaging facilities and enterprises, and become a global leader in chip packaging. It can be seen that the United States' mentality of "liking the new and hating the old" is vividly displayed, and TSMC sent talents and equipment to the United States, but it was "thrown off" before it got the subsidy. In fact, many people have long guessed that the United States invited TSMC to build a factory in the United States through the "Chips and Science Act", which is actually a big drama of "clever grabbing", and tens of billions of subsidies are just a trap set by them, even if they can't get subsidies, they will regard it as "protection money". On the question of whether the new regulations in the United States can boost the local packaging and testing industry, people are not optimistic, because the packaging and testing industry is located at the end of the integrated circuit industry chain and is a labor-intensive industry, while the labor cost in the United States is high, and it is difficult to form an advantage in this link. Therefore, if you want to avoid being suppressed by Chinese companies, cooperation with China may be the only way out, after all, China has advanced technology, cheap labor and the world's largest chip market. What do you think about this?
Science and Technology Edition broke the news that the United States will invest $3 billion to fund the local chip packaging industry, which is the first R&D investment project of the "Chips and Science Act". This move was seen by foreign media as a manifestation of the United States' concern about Chinese companies gaining more benefits in the chip industry chain. Because the packaging link plays a key role in the chip industry, and China's packaging capacity accounts for about 38% of the share, especially the leading level of Changdian Technology in packaging is eye-catching. JCET has not only successfully realized the packaging of advanced process mobile phone SoC, but also realized the integrated packaging of CPU, GPU and RF chips, and it is cost-effective, which is favored by international customers. In the face of China's strong position in the packaging industry, the United States began to cite the first reason, implying that it does not want chips made in the United States to be shipped overseas for packaging, so as to avoid the risk of ** chain. In fact, the purpose of this move by the United States is twofold, one is not to want Chinese companies to win more benefits in the chip industry chain, and the other is to worry that Chinese companies will one day get them stuck. U.S. Deputy Secretary of Commerce Laurie Locasio said that the goal of the investment plan is to make the United States a global leader in advanced packaging for chip volume by 2030, and they plan to have high-volume advanced packaging facilities and enterprises in the future. It can be seen that the mentality of the United States of "liking the new and hating the old" has been fully demonstrated. Although TSMC sent talent and equipment to the United States, it did not reap lasting benefits and rewards. In fact, many people have long guessed this outcome, the United States has attracted TSMC to build factories in the United States by revising the rules and the 10 billion subsidy plan, which is actually a big drama of "ingenuity and grabbing", and the 10 billion subsidy is just a trap, even if the subsidy is not obtained, the United States will regard it as a "protection fee". People are not optimistic about whether the new regulations in the United States can boost the local packaging and testing industry. The packaging and testing industry is located at the end of the chip industry chain and is a labor-intensive industry, while the labor cost in the United States is high, and it is difficult to form a competitive advantage. Therefore, if you want to get rid of the constraints of Chinese enterprises, cooperation with China may be the only choice. China has advanced technology, cheap labor, and the world's largest chip market, and has the advantages of cooperation with the United States.
To sum up, TSMC has been doubly lured and exploited in the Sino-US chip war. Although TSMC did not approve of building factories in the United States at the beginning, due to coercion and inducement and high dependence on American companies, TSMC had to send talents, technology and equipment to the United States. However, after the construction of the factory, the United States began to exert various restrictions and pressures on TSMC, constantly revising the subsidy rules, requiring the surrender of core business data, and restricting the construction and expansion of factories in the Chinese market. Recently, the United States decided to invest $3 billion to fund the local chip packaging industry, which was regarded by foreign media as a concern for Chinese companies to compete for interests in the chip industry chain. The actions of the United States show that it "likes the new and hates the old" mentality, and once it has reaped the benefits, it is easy to abandon its original partners. However, it is not optimistic that the United States wants to form a competitive advantage in the local packaging industry, which is labor-intensive, and the labor cost in the United States is high. Therefore, cooperation with China may be the only way to get rid of the oppression of Chinese companies, after all, China has advanced technology, cheap labor and the world's largest chip market. Everyone's opinion on this matter may be different.