With the continuous development of semiconductor technology, the microelectronics industry has higher and higher requirements for high-performance silicon wafer semiconductor chips in the research and production process of integrated circuits. Particle and metal impurities on the wafer surface can seriously affect the quality and yield of the equipment.
Therefore, it is necessary to achieve a high cleanliness effect and high cleaning efficiency on the surface of silicon wafer materials, but in addition to the harmful contaminants that adhere to the wafer surface, it is also necessary that the wafer surface be free from damage. As a result, low-temperature plasma cleaning technology has become the preferred cleaning method for semiconductor components.
Plasma activation can increase the roughness of the wafer surface, improving wafer adhesion and coating performance. In addition, plasma activation on the wafer surface can also change the chemical properties of the wafer surface, such as the introduction of specific functional groups to achieve functional modification of the surface.
At present, in the application process of silicon wafer semiconductor material surface cleaning technology, the use of plasma cleaning technology has the advantages of convenient operation, high efficiency, clean surface, no scratches, and is conducive to ensuring product quality.
Plasma cleaning not only cleans the wafer surface, but also improves surface activity, improves adhesion to the material surface, and improves soldering ability and hydrophilicity. The advantages are obvious. Therefore, wafer surface plasmon activation has broad application prospects in the fields of semiconductors, optoelectronics, materials science, etc., and has attracted more and more attention.
Plasma cleaners are widely used in semiconductor manufacturing processes, primarily to clean and remove impurities, organics, and other contaminants. Here are just a few of the applications in semiconductor manufacturing that are handled with the help of plasma cleaners:
1.Mask cleaning: During semiconductor manufacturing, plasma cleaners can use plasma to remove contaminants from the surface of the mask to ensure the accuracy and stability of the mask.
2.Wafer cleaning: During the wafer fabrication process, contaminants of inorganic and organic matter can adhere to the wafer surface. These contaminants can affect the quality and performance of the chip. Plasma cleaners can use the chemical reactions and physical effects produced by high-energy plasma to remove these contaminants from the surface of the chip, thereby improving the quality and reliability of the chip.
3.Metal cleaning: During semiconductor assembly, metal sheets and other metal parts need to be cleaned. Plasma cleaners can use plasma to remove contaminants from metal surfaces, such as oxide films, grease, and other organics, to ensure cleanliness and adhesion of metal surfaces.
To sum up, plasma cleaners play an important role in semiconductor manufacturing, which can ensure the quality and performance of semiconductor products.