At the recent IEEE International Electronic Components Conference (IEDM) panel workshop, TSMC revealed its 14nm process technology is in full swing. The new technology, which will be officially named A14, is expected to go into mass production between 2027 and 2028.
According to foreign media reports, the specific parameters and mass production time of A14 process technology were not disclosed at the meeting, but considering that the 2nm process technology is planned to start mass production in 2025 and the N2P process technology is planned to be mass-produced by the end of 2026, the expected launch time of A14 process technology is more reasonable, set in 2027 and 2028.
In terms of technology, it is likely that the A14 process technology will not use vertically stacked complementary field-effect transistor (CFET) technology, but will rely on TSMC's second- or third-generation surround-gate field-effect transistor (GAAFET) technology, which is similar to the N2 process technology. However, in order to truly exploit its performance and achieve new breakthroughs in performance and power levels, both A14 and N2 process technologies need to be optimized at the system level.
In addition, there is no clear information on whether the A14 process technology uses High-NA EUV lithography. Considering Intel's plans to adopt High-NA EUV** technology, it will be easier for TSMC to use these machines. However, halving the size of High-NA EUV** technology may create new challenges and demands, placing higher demands on chip designers and manufacturers.
It is important to note that although the specifics of the A14 process technology are still to be disclosed, TSMC's engineers and developers are already fully committed to the development of the next generation of process nodes. As technology continues to advance, this new 1The launch of the 4nm process A14 will bring new possibilities to the semiconductor industry and will also be an important step for TSMC in technological innovation.
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