At the critical moment, the domestic chip showed the hole card
After the United States changed the wafer rules, Huawei and other domestic manufacturers entered the field of wafer semiconductors in a big way, not only researching more types of wafers, but also allowing more wafers to enter domestic manufacturing, and SMIC alone has continuously invested more than 150 billion yuan to expand production.
2022 is a breakthrough year for domestic manufacturers, for example, Huawei has opened up the domestic mobile phone industry chain and realized the localization of more than 13,000 components and more than 4,000 circuit boards.
SMIC dared to compete with major international manufacturers in mass production of chips, and orders for advanced processes such as 14nm were placed again before the chip rules were changed.
Xiaomi, OPPO, Alibaba, etc. launched self-developed chips, and TSMC said that it could not evaluate the comprehensive computing power of the chips of various Chinese companies in detail.
As a result, the United States further restricted shipments, not only restricting the shipments of high-performance chips by TSMC and Nvidia, but also signing a tripartite agreement requiring Japan to restrict the shipment of 23 kinds of semiconductor products and the shipment of conventional DUV lithography machines in the Netherlands.
The data shows that Japanese semiconductor products occupy 1 3 of the domestic market, and the Dutch ASML almost occupies the mid-to-high-end lithography machine market.
The United States, Japan and the Netherlands signed a tripartite agreement to cut off the first chain of advanced process chips, and even block the process of chips above 28 nanometers.
However, after the announcement of the tripartite agreement, the performance of domestic manufacturers has been mediocre, and ASML said that the Chinese market is crucial, and it will allocate more capacity to Chinese manufacturers and ship more lithography machines.
The Netherlands also said that although the tripartite agreement limits the shipment of some lithography machine models, it can still ship early lithography machine models such as the 1980i, which can make the current chip supply outstrip demand.
Rare metals such as germanium and gallium were then regulated, which was a comeback.
Now, the new lithography regulations have officially arrived, and the Netherlands has restricted DUV lithography shipments from September 1, which means that advanced process chips can only rely on domestic lithography.
It was at this critical moment that domestic chips showed their cards.
First of all, Shanghai Microelectronics' 28-nanometer precision lithography machine has achieved technical verification, and the domestic semiconductor industry chain has the ability to produce Duvi lithography machine, and the wafer process can be reduced to 7 nanometers under multiple first-class processes.
Li Nan has also publicly stated that in the next 12 months, China will achieve a complete non-US 7nm process.
Prior to this, Huawei and domestic manufacturers announced that they had realized the localization of EDA tools above 14nm, but SMIC suddenly went offline after introducing the 14nm process.
It is reported that SMIC's move is to verify the 14nm process outside the United States by uniting domestic manufacturers. After all, the risks of SMIC's 28nm and other processes have continued to decrease.
Secondly, Huawei has opened the Mate60Pro Pioneer Program, and sold Mate60Pro through Huawei**, etc., and also announced the detailed configuration information of Huawei Mate60Pro, but the chip was not announced.
However, some professionals have taken Huawei Mate60Pro apart and found that there is still one on the chip"hesi"logo, 2035-CN02 and other words.
CN stands for China, which seems to mean that the chip is produced in China, and there is also news that it is a Kirin 9000s, which has similar performance to the Qualcomm Snapdragon 888 chip.
Regarding the information about the Huawei Mate60Pro chip, we can only wait for Huawei's official release, and the online news is for reference only.
However, Yu Chengdong publicly said at the harmonyos4 press conference that the light boat has passed the Wanzhong Mountain, and Huawei's flagship mobile phone is also on its way back, which seems to imply that the chip equipped with Huawei Mate60Pro has a surprise.
Finally, SMIC announced that the wafer expansion is basically complete, and it is expected to have an equivalent production capacity of more than 700,000 8-inch wafers by the end of this year.
These capacities will be used to produce and manufacture different types of chips, with a monthly production capacity of up to 100 million to 1400 million pieces.
The key is that the major wafer giants are reducing capital expenditure, but SMIC is not, and the capital expenditure in 2023 and 2022 is basically the same, mainly for wafer expansion and advanced process wafer research and development.