I. Introduction.
As an efficient and environmentally friendly refrigeration technology, semiconductor refrigeration sheets have been widely used in many fields. This article will introduce the manufacturing process of semiconductor refrigeration chips in detail, including material preparation, manufacturing process, and testing. Through the introduction of this article, I hope to help readers better understand the basic principles and manufacturing methods of semiconductor refrigeration sheets.
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2. Preparation of materials.
1.Semiconductor materials: The core materials of semiconductor refrigeration sheets are semiconductor materials, such as silicon, germanium, etc. These materials have high thermal and electrical conductivity, which is the key to achieving cooling results.
2.Heat dissipation materials: In order to dissipate the heat of semiconductor materials in a timely manner, it is necessary to select appropriate heat dissipation materials. Commonly used heat dissipation materials include metallic materials such as copper and aluminum, as well as non-metallic materials such as ceramics.
3.Insulating materials: In order to ensure the normal operation of semiconductor refrigeration sheets, it is necessary to select materials with good insulating properties. Commonly used insulating materials are polyimide (PI), polytetrafluoroethylene (PTFE) and so on.
Third, the production process.
1.Cleaning: First of all, the semiconductor material needs to be cleaned to remove impurities and oxides on the surface to ensure its good conductivity.
2.Heat treatment: The cleaned semiconductor material is heat treated to improve its thermal and electrical conductivity.
3.Prepared electrodes: Electrodes are prepared on both sides of the semiconductor material to achieve the conduction of current and the transfer of heat. Commonly used electrode materials are gold, silver and other metal materials.
4.Insulation treatment: Insulation treatment is carried out between the electrode and the semiconductor material to prevent the occurrence of current short circuit and leakage. Commonly used insulation treatment methods include coating insulating materials, vacuum encapsulation, etc.
5.Heat dissipation treatment: A heat dissipation structure is prepared on the back of the semiconductor cooling sheet to dissipate heat in time. Commonly used heat dissipation structures include metal heat sinks, cooling fans, etc.
Fourth, testing. After the semiconductor cooling sheet is manufactured, it is necessary to perform a performance test to evaluate its cooling effect. Commonly used test methods include temperature test, heat flux test, etc. Through the test results, we can understand the cooling performance, stability and reliability of semiconductor cooling sheets. At the same time, according to the test results, the semiconductor refrigeration sheet can be optimized and improved to improve its performance and quality.
V. Conclusions. This article introduces the manufacturing process of semiconductor refrigeration sheet in detail, including material preparation, manufacturing process, and testing. Through the introduction of this article, I hope to help readers better understand the basic principles and manufacturing methods of semiconductor refrigeration sheets. At the same time, we also hope to help readers make and use semiconductor refrigeration chips more handy, and improve their performance and quality.