The 2023 52audio Golden Sound Award for the annual audio main control chip award is hosted by I Love Audio Network, and is based on actual and objective proof. The award aims to encourage chip companies and technical R&D personnel to continue to innovate, and at the same time, encourage brands to apply more abundant products and promote the technological progress and development of the industry. By recognizing innovative achievements, it stimulates the innovation vitality of enterprises and individuals, thereby promoting the technological progress of the entire industry.
After the evaluation of the proportion of application cases of TWS headset dismantling and summary in 2023, the evaluation of the latest high-quality series of audio master control chips in 2023, and the evaluation of the most reader satisfaction votes in 2023, Telink TLSR9516A multi-standard wireless audio SoC successfully won the 2023 52Audio Golden Tone Award for Audio Master Control Chip of the Year.
In 2023, among the products disassembled by I Love Audio.com, seven products from 7 major brands, including Xiaomi, Razer, Smog, JBL, Edifier, Fierce Horse, and Core, will adopt Telink Microelectronics' multi-standard wireless SoC.
The 7 products cover TWS headsets, wireless gamepads, wireless XR headsets, headphones, wireless lavalier microphones, walkie-talkies and many other categories, and the types and models of chips applied include:
Multi-standard wireless SoC: TLSR9517C, TLSR9517B, TLSR9515;
Multi-standard wireless audio SoC: TLSR9616A;
Bluetooth LE SoC: TLSR8721.
Telink TLSR9516A multi-standard wireless audio SoC supports Bluetooth 53. Basic Data Rate (BR), Enhanced Data Rate (EDR), LE and Bluetooth LE Mesh standards, the features and functions required to integrate high-quality wireless audio devices on a single chip.
Telink's TLSR9516A integrates powerful 32-bit RISC-V (RISC-Five) MCU, DSP, and 24GHz ISM radio, 256KB SRAM, 2MB Flash, mono audio codec, AUX ADC, analog and digital microphone inputs, PWM, flexible IO interface, and other peripheral modules required for advanced audio applications; A multi-stage power management design is also included, allowing for ultra-low power operation.
Founded in June 2010, Telink Microelectronics (Shanghai) Co., Ltd. is mainly engaged in the R&D, design and sales of wireless Internet of Things (SoC) SoCs, focusing on the development and breakthrough of cutting-edge technologies in the field of wireless Internet of Things chips. Through years of continuous research and development accumulation, it has become one of the representative enterprises with the most complete product range in this segment in the world.
The core parameters of Telink's main products meet or exceed the technical level of leading international enterprises, and widely support various consumer and commercial IoT applications, including smart retail, consumer electronics, smart lighting, smart home, smart healthcare, warehousing and logistics, and audio entertainment. The products are widely used in many well-known mainstream terminal brands such as Hanshow, Xiaomi, Logitech, Home Control, Tuya Smart, LEDVANCE, Renesas, iFLYTEK, Skyworth, Sharp, Panasonic, Nvidia, Harman, etc.