The perfect combination of printed circuit board PCB technology innovation and ZEISS solutions

Mondo Technology Updated on 2024-02-07

As the core component of electronic products, printed circuit boards (PCBs) carry the important tasks of connecting and relaying electronic components. With the continuous development of technology, especially the increasing demand for intelligence, miniaturization and multi-functionality of electronic products such as smartphones, tablets and wearable devices, the PCB industry is facing unprecedented technical challenges.

PCB designs are rapidly evolving to meet market trends. Traditional HDI technology is difficult to meet today's stringent requirements for smaller size, higher integration, and longer battery life due to its process limitations. As a result, SLP (Carrier Board-like) technology has emerged and become the focus of attention in the industry. SLP uses the MSAP process to significantly reduce the line width and spacing, improve the line density, thereby effectively reducing the area and thickness of the PCB, and providing the possibility for the improvement of battery capacity and the further miniaturization of electronic products.

However, the MSAP process also brings its own unique technical difficulties, such as poor line uniformity and short circuits caused by copper residues. These problems pose a serious threat to the quality and reliability of PCBs.

In this context, ZEISS Crossbeam systems offer innovative solutions for the PCB industry with their outstanding performance. The system combines field emission scanning electron microscopy (FE-SEM) and focused ion beam (FIB) technology to quickly and accurately detect residual copper between the inner lines of the SLP. Its femtosecond laser system can quickly locate the region of interest, which greatly improves the efficiency of sample analysis. At the same time, the laser processing is carried out in a separate chamber, which ensures that the main chamber of the electron microscope and the detector are clean and pollution-free. In addition, the Crossbeam electron microscope can be linked to a 3D X-ray microscope to accurately locate deeply buried defects.

ZEISS not only supplies state-of-the-art microscopes and inspection equipment, but also has:Blue light scanners, industrial CTand a series of rich product lines.

These all-round quality solutions are exactly what the PCB industry urgently needs in the process of technological innovation and upgrading. ZEISS products and services not only help customers solve today's technical challenges, but also support the future development of the PCB industry.

Related Pages