The United States restricts the shipments of a large number of chip semiconductor companies such as TSMC, resulting in the temporary inability to produce and manufacture advanced chips developed by Huawei.
Huawei has not only fully entered the field of chip semiconductors, but also invested heavily in the domestic chip industry chain to make joint breakthroughs.
The data shows that during the three years of the restriction, Huawei's debt increased rapidly, which may have been caused by its large investment in the chip semiconductor industry.
But Huawei just got the result, the Kirin 9000S chip has been made domestically, and foreign media said that it is close to or has reached the 7nm level, and the actual performance is comparable to Qualcomm's 5nm chip.
Huawei uses the Kirin 9000S chip in its own high-end devices, such as the Huawei Mate 60 series and Huawei Mate X5.
Huawei also released the new Nova series of machines, using the self-developed Kirin 9000SL and Kirin 8000 chips, and the Ascend 910B chip, which iFLYTEK said was comparable to the Nvidia A100 chip.
Huang acknowledges that Huawei is one of its strongest competitors in AI chip manufacturing.
After the appearance of the Kirin 9000S chip, ASML announced that it had obtained permission to continue to ship 2000i and other models of lithography machines to China, and all prepaid lithography machine orders from Chinese manufacturers were delivered.
ASML said that Huawei's self-developed lithography machine industry chain is an act that undermines the global industrial chain.
From the statements of Huang Jenxun and ASML, it can be seen once again that Huawei has just exchanged results, Kirin 9000S chips have been recognized, and Huawei Mate60 series mobile phones are in short supply.
Although it is not clear about the specific sales volume of Huawei's Mate60 series, Huawei's revenue in the fourth quarter of 2023 is about 250 billion yuan, most of which are brought by Huawei's Mate60 series mobile phones.
The key is that Huawei HiSilicon released a poster, saying that Vientiane Xinsheng will be born in 2024, which undoubtedly implies that Huawei chips will make big moves this year.
From the current news, it can be seen that Huawei may apply more chips to new machines this year, so as to achieve Huawei chips covering all high, medium and low equipment.
Qualcomm also gave **, saying that Huawei may not buy new Qualcomm chips in 2024, and it is expected that domestic shipments will decrease by 40 million to 60 million.
Yu Chengdong also publicly said that Huawei will have products that subvert the industry this year.
In addition, SMIC has completed the wafer expansion work, which can achieve a monthly output of more than 100 million chips of various types, and some 2000i and other models of lithography machines, these equipment can be used in the 5nm process, but the cost is higher and the yield rate is lower.
Xu Zhijun has publicly appealed that domestic manufacturers will adopt more domestic chips and other products, so as to promote the development of the domestic industrial chain, and Huawei's chip self-sufficiency rate has reached 70%, which is equivalent to admitting that China will soon achieve greater breakthroughs.
The key is that Huawei's folding screen mobile phone, Huawei P70, etc., may use more advanced Kirin chips.
Huawei's mobile phone flagship has returned to normal iteration, which is enough to show that Huawei has solved problems such as chip production capacity, and the self-developed Kirin chip can also fully support Huawei's high-end flagship mobile phones.
Huawei also has hyper-threading technology and advanced packaging technology, which can greatly improve the performance of chips without changing the chip manufacturing process.
What's more, Huawei has developed its own Taishan architecture, Lingxi instruction set, etc., and the Ascend 910B chip uses the Taishan architecture.
If these technologies are applied to Kirin chips, the result will definitely be as Yu Chengdong said, Huawei has subversive products this year.