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Since the chip manufacturing technology has been upgraded to 7nm, the EUV (Extreme Ultr**IOLET) lithography machine has become an indispensable key equipment. In the past few years, many chipmakers, including TSMC, Samsung and Intel, have been racing to purchase EUV lithography machines from the Dutch company ASML, because whoever can have more EUV lithography machines can increase production capacity and stabilize future orders. TSMC has always occupied a dominant position, according to data, since ASML began to produce EUV lithography machines, by the end of 2023, a total of more than 230 EUV lithography machines have been shipped, of which TSMC alone occupies more than 50% of the share. Recently, however, the situation may have changed, with ASML delivering its state-of-the-art EUV lithography machine, the Twinscanexe:5200, to Intel instead of TSMC.
This EXE:5200 lithography machine has a significant improvement over the previous EXE:5000, that is, the numerical aperture (NA) has been increased from 033na increased to 055na。The numerical aperture represents how much light the system is able to collect and focus, and the larger the NAA, the more light it can collect, and therefore the higher the resolution. Therefore, having 0Lithography machines with 55Na numerical aperture can be used to fabricate 2nm or even 14nm chip. Previously, the CEO of ASML had said that in 0After 55NA, i.e. after NXE:5200, ASML may not be able to launch a more advanced EUV lithography machine because the technology has reached its limits. As for this NXE: 5200's ** is about 300 million US dollars, which is equivalent to about 21 yuan500 million yuan, the wafer processing speed is 220 pieces of 12-inch wafers per hour, a wafer can cut about 500 pieces of 2nm chips, theoretically, a such lithography machine can process hundreds of millions of chips a year.
However, ASML delivered this advanced 2nm lithography machine to Intel instead of TSMC, which has always been dominant. Some people think that this may be because TSMC does not need such a device at the moment, and Intel needs it more. However, I think this reason may not be valid, because TSMC will definitely need this device as well. The more likely reason is that there is pressure from the United States, which is currently trying to revive the chip manufacturing industry, and Intel has proposed IDM20 plan, hoping to get a share in the field of chip foundry. ASML must obey the will of the United States and allocate resources according to the requirements of the United States. Previously, Intel boasted that it would achieve the 20A process in 2024, that is, to manufacture 2nm chips, while TSMC would not achieve it until 2025. As a result, Intel wanted to get a head start and successfully acquired the first 2nm lithography machine.
Next, TSMC needs to redouble its efforts. If Intel takes the lead in 2nm technology, the global chip foundry pattern may be rewritten. TSMC has always been the world's leading chip foundry, widely praised for its advanced manufacturing processes and high-quality chips. However, in recent years, competition in the global chip manufacturing industry has intensified, especially in the United States, which is eager to revive the local chip manufacturing industry to reduce dependence on countries such as China. Therefore, Intel has 2nm lithography technology ahead of TSMC, which may change the landscape of global chip foundry.
In the face of this challenge, TSMC needs to take corresponding countermeasures. First of all, accelerate technology research and development and innovation, and strive to achieve a breakthrough in the 2nm process as soon as possible. TSMC has always been technology-driven as its core competitiveness, and has continuously promoted the progress of chip manufacturing technology through continuous R&D investment and innovation. The incident of being preemptively obtained by Intel for the 2nm lithography machine will put forward higher requirements for TSMC, and it is necessary to further increase research and development efforts and accelerate process breakthroughs.
Secondly, strengthen cooperation with customers and partners to ensure the stability of the first chain. TSMC has always maintained close cooperative relations with many customers and partners to jointly promote the development of the chip industry. Now, in the face of more fierce competition and chain pressure, TSMC needs to strengthen communication and cooperation with customers and partners, optimize the chain, ensure stability, and meet customer needs in a timely manner.
In addition, TSMC also needs to continue to improve production efficiency and quality control. As the chip manufacturing process continues to advance, the manufacturing process is becoming more and more complex and sophisticated. TSMC needs to continuously improve its production processes, optimize equipment configurations, and improve production efficiency and quality control to meet the growing demand for chips.
ASML delivered the most advanced 2nm lithography machine to Intel instead of TSMC, which has always been dominant. This is a huge challenge for TSMC, which has always been the world's leading chip foundry. However, in the face of fierce global chip manufacturing competition and the U.S. plan to revitalize the chip manufacturing industry, TSMC needs to redouble its efforts to accelerate technology research and development and innovation, strengthen cooperation with customers and partners, and improve production efficiency and quality control to meet this challenge. In the competition for 2nm technology, whoever can take the lead in breaking through is likely to rewrite the pattern of global chip foundry. TSMC needs to stay on top of its guns and go all out to achieve technological breakthroughs to ensure its leading position in the global chip manufacturing industry.
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