Outline of the article.
Wafer fabrication equipment
Encapsulation equipment
Test equipment
Wafer fabrication equipment, packaging equipment, and test equipment are important components of the semiconductor equipment industry, and these three types of semiconductor equipment will be described in detail below.
1.Wafer fabrication equipment
1.1 Types of wafer fabrication equipment
Wafer fabrication equipment is one of the most important equipment in the semiconductor production process, which is mainly divided into two categories: front-end process equipment and back-end process equipment.
Front-end process equipmentIt is an important equipment in the semiconductor manufacturing process, mainly used in wafer manufacturing. The following is a detailed introduction to the front-end process equipment:
(1) Thin film deposition equipment:Thin film deposition equipment is an important part of the front-end process equipment, which is used to deposit various thin film materials, such as metals, oxides, etc., on the surface of the wafer. Thin film deposition equipment typically uses techniques such as physical vapor deposition (PVD) or chemical vapor deposition (CVD) to achieve uniform and stable thin film deposition.
(2) Etching equipment:Etching equipment is used to etch the surface of a wafer to create the desired circuit lines and holes. Etching equipment typically uses technologies such as Reactive Ion Etching (RIE) or Plasma Etching to achieve high-precision, high-efficiency etching operations.
(3) Lithography equipment:Lithography equipment is the core equipment in the front-end process equipment and is used to transfer the circuit pattern to the wafer surface. Lithography equipment typically uses an ultraviolet or X-ray light source to achieve high-resolution, high-sensitivity lithography operations.
(4) Measuring equipment:Metrology equipment is used to perform various measurements and inspections on the wafer surface to guarantee the quality and reliability of the chip. Measurement equipment usually uses optical microscopes, scanning electron microscopes (SEM) and other equipment to achieve high-precision and high-efficiency measurement and inspection operations.
(5) Cleaning machine:Cleaning machines are used to clean impurities and contaminants on the surface of wafers to ensure quality and stability in the chip manufacturing process. Cleaning machines usually use ultrasonic cleaning, spray cleaning and other technologies to achieve efficient and thorough cleaning operations.
(6) CMP equipment:CMP equipment is used to flatten the surface of wafers to ensure stability and accuracy in the chip manufacturing process. CMP equipment typically uses chemical mechanical polishing (CMP) technology to achieve high-efficiency, high-precision planarization operations.
(7) Gluing and developing equipment:Gluing development equipment is used to coat the surface of a wafer with photoresist and develop the photoresist to form the desired circuit pattern. Gluing Developing equipment usually uses rotary gluing, spray gluing and other technologies to achieve uniform and stable gluing and developing operations. (8) Heat treatment equipment:Heat treatment equipment is used to heat treat wafers to achieve the desired chemical reactions and physical changes. Heat treatment equipment typically employs technologies such as rapid heat treatment (RTP) or high-temperature annealing to achieve efficient and stable heat treatment operations.
Downstream process equipmentIt is an important equipment in the semiconductor manufacturing process, mainly used in packaging and testing. The following is a detailed introduction to the back-end process equipment:
(1) Scribing equipment: Dicing equipment is used to divide wafers into individual chips for packaging and testing. The dicing equipment usually adopts laser or mechanical dicing and other methods to achieve high-precision and high-efficiency dicing operation. (2) Encapsulation equipment: Encapsulation equipment is used to encapsulate chips on substrates to ensure the normal operation and service life of chips. Packaging equipment usually uses wire bonding, flip chip and other methods to achieve high-efficiency and high-reliability packaging operations. (3) Test equipment: Test equipment is used to test the function and performance of the chip to ensure the quality and reliability of the chip. Test equipment usually uses oscilloscopes, signal generators, spectrum analyzers and other equipment to achieve high-precision and high-efficiency test operations. (4) Baking equipment: The baking equipment is used to bake the chip to eliminate the residual stress inside the chip and improve the stability and reliability of the chip. Baking equipment usually uses high-temperature ovens or microwave ovens to achieve efficient and stable baking operations. (5) Marking equipment: Marking equipment is used to mark the surface of the chip for subsequent identification and management. Marking equipment usually adopts laser marking, mechanical marking, etc., to achieve high-precision and high-efficiency marking operations. (6) Packaging equipment: Packaging equipment is used to package chips to protect them from the outside environment. Packaging equipment usually adopts vacuum packaging, metal shell packaging, etc., to achieve high-reliability packaging operations.
1.2 Composition and characteristics of wafer fabrication equipment
Wafer fabrication equipment is mainly composed of the following parts:
(1) Manipulator:It is used to handle wafers and components with high precision, high speed and high reliability. (2) Control system:It is used to control all parts of the equipment, including manipulators, conveyor belts, process equipment and testing equipment, etc., to achieve automated production. (3) Process equipment:According to the process requirements, complete specific manufacturing links, such as lithography, etching, thin film deposition, etc. (4) Testing equipment:It is used to test the quality and performance of chips, including appearance inspection, function testing and performance testing. (5) Auxiliary equipment:For example, deionized water equipment, compressed air equipment, etc., are used to provide auxiliary substances required in the process.
The characteristics of wafer fabrication equipment are mainly manifested in the following aspects:
(1) High precision:Wafer fabrication equipment has very high precision requirements and needs to be operated at the nanometer level to ensure the quality and performance of the chips.
(2) High speed:Wafer fabrication equipment is fast, capable of completing a large amount of manufacturing work in a short period of time, improving production efficiency.
(3) High reliabilityWafer fabrication equipment is highly demanding for reliability, as failure can lead to significant production disruptions and product losses.
(4) High degree of automationWafer fabrication equipment has a high degree of automation, which can realize automated production processes and process control, and improve production efficiency and product quality.
(5) Environmental protection and energy savingWith the increase of environmental awareness, the design and manufacture of wafer fabrication equipment also pay more attention to environmental protection and energy saving, reducing the impact on the environment.
1.3 Trends in wafer fabrication equipment
As semiconductor technology continues to evolve and advance, so does wafer fabrication equipment. The development trend of wafer fabrication equipment in the future mainly includes the following aspects:
(1) Higher production efficiency:As the semiconductor market continues to expand and competition intensifies, wafer fabrication equipment requires higher production efficiency to meet market demand. To improve production efficiency, wafer fabrication equipment needs to achieve greater speed, higher accuracy, and more reliable stability. For example, robotic equipment needs to achieve faster and more accurate handling and positioning, and control systems need to achieve more efficient and stable control and scheduling.
(2) More refined manufacturing process:With the increasing complexity of semiconductor chips and the continuous refinement of process requirements, wafer fabrication equipment needs to have more refined manufacturing processes. For example, lithography equipment needs to achieve finer lithography lines and higher resolution, and thin film deposition equipment needs to achieve more uniform and stable thin film deposition. In addition, etching equipment, measurement equipment, etc., also need to continuously improve the process technology to adapt to more refined process requirements.
(3) Smarter control system:With the continuous development of automation technology and artificial intelligence technology, wafer fabrication equipment needs to implement smarter control systems. Through the introduction of artificial intelligence, machine learning and other technologies, the autonomous control and optimal scheduling of equipment can be realized, and the production efficiency and product quality can be improved. For example, the control system can learn and analyze production data through machine learning algorithms to achieve fine control and optimization of the production process.
(4) More environmentally friendly production methods:With the increasing environmental awareness and increasingly stringent policies and regulations, wafer fabrication equipment needs to achieve more environmentally friendly production methods. Equipment needs to be manufactured and used to minimize environmental impact, such as adopting energy-efficient design and reducing waste emissions. In addition, the equipment also needs to continuously improve the process technology to reduce the pollution to the environment.
(5) More flexible production line:As market demands change and technology evolves, wafer fabrication equipment needs to enable more flexible production lines. The production line needs to be more adaptable, scalable, and maintainable to adapt to the production of different types of chips with different process requirements. For example, the production line can realize the flexible combination and expansion of different equipment through modular design, and realize the best maintenance and rapid repair of equipment through the intelligent maintenance system.
(6) Lower manufacturing cost:In order to be competitive in the market, wafer fabrication equipment needs to achieve lower manufacturing costs. Cost control and optimization are required in terms of material selection, design optimization, and production process of equipment. For example, equipment can reduce manufacturing costs by adopting new materials, optimizing structural design, and simplifying production processes. In addition, equipment needs to reduce operating costs by improving production efficiency and reducing failure rates.
In conclusion, the development trend of wafer fabrication equipment is multifaceted, including improving production efficiency, enabling more refined manufacturing processes, enabling smarter control systems, enabling greener production methods, enabling more flexible production lines, and reducing manufacturing costs. These trends will help improve the performance and market competitiveness of wafer fabrication equipment and promote the sustainable development of the semiconductor industry.
2.Encapsulation equipment
2.1 The basic components of the packaging equipment
Packaging equipment is an indispensable part of the semiconductor manufacturing process, mainly used to package chips on substrates to realize the connection and protection of circuits, and ensure the normal operation and service life of chips. The packaging equipment is usually divided into two parts: the pre-process and the post-process
(1) Pre-process equipment:The pre-process process is to attach the chip to the board and connect the circuit. Common equipment includes chip bonding machines, lead welding machines, and gold ball welding machines, among others.
(2) After-process equipment:The post-processing process is the process of cutting, grinding, and plating the package. Common equipment includes cutting machines, grinding machines, and electroplating machines.
Packaging equipment is a vital part of the semiconductor manufacturing process, and its basic components include the following main parts:
(1) Conveyor system:The conveyor system of packaging equipment is mainly composed of conveyor belts, robots or robots, etc., which are used to transfer chips and substrates from one station to another. This conveyor system needs to be characterized by high accuracy, high speed and high reliability to ensure that the equipment can efficiently complete the packaging task. (2) Positioning system:The positioning system of the packaging equipment is used to ensure that the chip and substrate can be placed in the correct position accurately. This positioning system usually consists of a series of sensors and controllers, such as optical sensors, electromagnetic sensors, etc., which are used to monitor and control the precise position of the chip and substrate. (3) Processing system:The processing system of the packaging equipment is used to perform various processing operations between the chip and the substrate, such as soldering, crimping, cutting, etc. This processing system usually consists of a series of machines and tools, such as wire bonders, pressure welders, cutting machines, etc. These machines and tools need to be selected and configured according to different packaging needs to meet the packaging requirements of different types of chips. (4) Detection system:Inspection systems for packaging equipment are used to inspect the quality of the connection and the quality of the package between the chip and the substrate. This inspection system usually consists of a series of sensors and test equipment, such as optical inspection equipment, electrical test equipment, etc. These sensors and test equipment need to be characterized by high accuracy and efficiency in order to quickly and accurately detect defects and problems in the packaging process. (5) Control system:The control system of the encapsulated equipment is used to control the operation of the entire equipment and the coordination of the various systems. This control system usually consists of a computer, PLC or embedded system, etc., which is used to receive signals from sensors and control the operation of the equipment according to preset programs and instructions. The control system needs to be characterized by high reliability, high stability and high flexibility to ensure that the equipment can efficiently complete various packaging tasks. (6) Auxiliary system:Encapsulation equipment also requires some auxiliary systems, such as vacuum system, cooling system, hydraulic system, etc., to support the normal operation of the equipment and processing operations. These assistance systems need to be configured and used according to the specific needs of the device to ensure that the device can efficiently complete the packaging task.
In addition to the above main components, packaging equipment also needs to have the characteristics of high reliability, high stability, high precision and high efficiency. These characteristics need to be fully considered and guaranteed in the design, manufacture and use of the equipment. At the same time, with the continuous development and progress of semiconductor technology, packaging equipment also needs to be continuously upgraded and improved to meet the changing market demand and technical requirements.
2.2 Workflow for encapsulating devices
The workflow of packaging equipment is a very important part of the semiconductor manufacturing process, and the following is a detailed introduction to the workflow of packaging equipment:
(1) Preparation stage:In the preparation stage, according to the type, specification and packaging requirements of the chip, the appropriate packaging equipment and its accessories are selected, and installed and debugged. This phase also includes technical training and safety operation instructions for operators to ensure that the equipment can operate normally and operate safely.
(2) Chip mounting:In the die attach stage, the chip is placed on a substrate and fixed and connected using a packaging device. This stage requires the use of sophisticated robots and conveyors to ensure that the chips can be accurately placed on the substrate. At the same time, it is necessary to connect the pins of the chip to the pins of the substrate using equipment such as a wire bonder.
(3) Pin soldering:In the pin bonding stage, the pins of the chip are soldered to the pins of the substrate using equipment such as a wire bonder. At this stage, factors such as temperature, time, and pressure of soldering need to be controlled to ensure the soldering quality and the electrical properties of the chip. At the same time, welding results need to be tested and documented to ensure welding quality and consistency.
(4) Plastic curing:In the molding curing stage, the chip and substrate are encapsulated together and allowed to cure using a molding material. This stage requires the use of sophisticated conveyors and heating systems to ensure uniform distribution and curing of the molding material. At the same time, factors such as curing temperature, time and pressure need to be controlled to ensure the quality of the molding and the stability of the chip.
(5) Testing and verificationDuring the test and verification phase, the packaged chips are tested for function and performance to ensure that they meet the design requirements and specifications. This stage requires the use of various test equipment and test procedures, such as oscilloscopes, signal generators, spectrum analyzers, etc., to test the electrical performance and stability of the chip. At the same time, test results need to be recorded and analyzed to identify problems and areas for improvement.
(6) Packaging and shipment:In the packaging and shipping stage, the chips that pass the test will be packaged and shipped. This stage requires the use of suitable packaging materials and containers to protect the chip from mechanical damage and environmental influences. At the same time, it is also necessary to carry out packaging design and shipping and transportation arrangements according to the customer's requirements to ensure that the product can be delivered to the customer safely and accurately.
2.3 Performance requirements for packaged equipment
The performance requirements of packaging equipment are to ensure the quality, stability and reliability of semiconductor devices, and the following is a detailed introduction to the performance requirements of packaging equipment:
(1) High precision and high efficiencyPackaging equipment needs to have the characteristics of high precision and high efficiency to ensure the packaging quality and production efficiency of semiconductor devices. High accuracy means that the device can accurately complete various operations, such as die mounting, pin soldering, plastic curing, etc., to ensure that the package position, pin connection, and uniform distribution of plastic material meet the design requirements and specifications. High efficiency means that the equipment can quickly complete various operations and improve production efficiency to reduce production costs and meet market demand.
(2) Stability and reliability:Encapsulation equipment needs to be stable and reliable to ensure long-term stable production and product reliability. Stability refers to the ability of the equipment to maintain stable performance and accuracy in the long-term continuous production process, and there will be no failures or errors. Reliability refers to the ability of equipment to reliably complete various operations under specified conditions, ensuring the quality and performance of the product.
(3) Adaptability and flexibility:Packaging equipment needs to be adaptable and flexible to meet the packaging needs of different types and specifications of semiconductor devices. Adaptability refers to the ability of a device to adapt to different types and specifications of chips and substrates to meet the packaging requirements of different products. Flexibility refers to the flexibility of the equipment to adjust and optimize various parameters and operations to adapt to different production needs and changes.
(4) Intelligence and automation:Encapsulation equipment needs to be intelligent and automated to reduce manual intervention and operator errors, and improve production efficiency and product quality. Intelligence refers to the ability of the device to automatically complete various operations according to preset programs and instructions, and to perform self-detection and fault diagnosis. Automation refers to the ability of equipment to reduce manual involvement and increase the degree of automation to reduce the impact of human factors on product quality.
(5) Safety and environmental protection:Encapsulated equipment needs to be safe and environmentally friendly to ensure the safety of operators and the environment. Safety refers to the ability of the equipment to ensure the safety of the operator and avoid safety accidents caused by improper operation or equipment failure. Environmental friendliness refers to the ability of equipment to adopt environmentally friendly materials and processes to reduce environmental impact and pollution.
(6) Maintainability and repairability:Encapsulated equipment needs to be maintainable and serviceable to ensure the normal operation and service life of the equipment. Maintainability refers to the ability of the equipment to easily carry out routine maintenance and maintenance, such as cleaning, lubrication, etc., to extend the service life of the equipment. Serviceability refers to the ability of equipment to be easily repaired and parts replaced in the event of a failure to reduce downtime and production costs.
(7) Other performance requirements:In addition to the performance requirements in the above aspects, the packaging equipment also has other performance requirements, such as: operability, repeatability, scalability, etc. Operability refers to the ability of the equipment to be easily operated and controlled to reduce the difficulty and errors of operation. Repeatability refers to the ability of equipment to repeatedly complete the same operations and production tasks to ensure the consistency and stability of the product. Scalability refers to the ability of equipment to be upgraded and expanded in response to production needs and technological advancements to meet changing market demands and technical requirements.
To sum up, the performance requirements of packaging equipment are multifaceted, and it is necessary to comprehensively consider the accuracy, efficiency, stability, reliability, adaptability, flexibility, intelligence, safety, environmental protection and other performance requirements of the equipment. These performance requirements need to be fully considered and guaranteed in the selection, design, manufacture and use of equipment to ensure the quality, stability and reliability of semiconductor devices.
3.Test equipment
3.1 The basic composition of the test equipment
Test equipment in semiconductor equipment is an important part of ensuring the quality and reliability of semiconductor products. Test equipment is the process of testing and evaluating semiconductor products to ensure that the quality and performance of the product meet the requirements. Among them, the basic composition of the test equipment includes the following main parts:
(1) Test hardware:Test hardware is the core component of test equipment, mainly including test interface boards, probe cards, test sockets, etc. The test interface board is an interface device used to connect the test program and test hardware, the probe card is an intermediate device used to connect the chip under test and the test interface board, and the test socket is the socket used to place the chip under test.
(2) Test software:Test software is a software program used to control test hardware and execute test procedures. Test software needs to be developed and optimized for different chips and test items to ensure the accuracy and reliability of test results.
(3) Data processing and analysis system:Data processing and analysis systems are used to process and analyze test data, turning test results into readable data reports and charts. The data processing and analysis system also needs to perform statistics and analysis of the test results to find problems in the product and the direction of improvement.
(4) Control system:The control system is used to control the operation and operation of the test equipment, including mechanical motion systems, temperature control systems, pressure control systems, etc. The control system needs to cooperate with the test software to achieve automated testing and control.
(5) Auxiliary system:Ancillary systems are used to support the operation and operation of test equipment, including cooling systems, cleaning systems, lighting systems, and more.
3.2 Classification of test equipment
The test equipment in semiconductor equipment can have various types depending on how it is classified. Here are some common classifications and corresponding types of test equipment:
1. Classification according to the purpose and function of the test
1) Wafer tester: It is used to test wafers during the manufacturing process to test the function and performance of chips. Wafer test equipment typically includes hardware such as test interface boards, probe cards, and test sockets, as well as software such as test programs and data processing systems.
2) Package tester: It is used to test after the chip is packaged to check the packaging quality and the performance of the chip. Packaging and testing equipment typically includes software such as test sockets, test programs, and data processing systems, as well as hardware such as mechanical operating platforms.
3) Reliability tester: used to evaluate and test the reliability of the chip, and test the stability and reliability of the chip in different environments. Reliability test equipment typically includes software such as environmental simulation equipment, test programs, and data processing systems, as well as hardware such as test samples.
4) Emulation tester: It is used to test the analog circuit of the chip and test the performance and function of the analog circuit. Analog test equipment typically includes hardware such as signal generators, oscilloscopes, logic analyzers, and software such as test programs and data processing systems.
2. Classification according to test links and processes
1) Front-end process tester: used to test the front-end process in the chip manufacturing process to test the quality and stability of thin film, lithography, etching and other processes. Front-end process testing equipment typically includes hardware such as optical microscopes, electron microscopes, and X-ray diffractometers, as well as software such as test programs and data processing systems.
2) Back-end process tester: used to test the back-end process in the chip manufacturing process to test the quality and stability of metal wiring, packaging and other processes. Back-end process testing equipment usually includes hardware such as probe stations, scanning electron microscopes, and energy dispersive instruments, as well as software such as test programs and data processing systems.
3) Out-of-line tester: used to conduct the final test of the chip that has been manufactured, and test the function and performance of the chip. Factory test equipment usually includes hardware such as test interface boards, probe cards, and test sockets, as well as software such as test programs and data processing systems.
3. Classification by operating system and platform
1) Windows operating system test equipment: The test equipment based on the Windows operating system uses the general PC hardware platform and the Windows operating system to test the chip by installing the corresponding test software.
2) Linux operating system test equipment: The test equipment based on the Linux operating system uses the general PC hardware platform and the Linux operating system to realize the chip test by installing the corresponding test software.
3) VXWORKS operating system test equipment: The test equipment based on the VXWORKS operating system uses the general PC hardware platform and VXWORKS operating system to test the chip by installing the corresponding test software. The VXWons operating system is usually used in application scenarios that require high real-time performance.
4) Mac OS operating system test equipment: The test equipment based on the Mac OS operating system uses the general Mac hardware platform and the Mac OS operating system to test the chip by installing the corresponding test software. The Mac OS operating system is often used for special application scenarios such as graphics processing.
Fourth, according to the brand and the first business classification
1) Keysight Test Equipment: Keysight is a world-renowned manufacturer of electronic measurement instruments, providing a range of test equipment in semiconductor equipment, including hardware equipment such as digital multimeters, signal generators, oscilloscopes, etc., and corresponding software.
2) Agilent Test Equipment: Agilent is another world-renowned manufacturer of electronic measuring instruments, providing a range of testing equipment in semiconductor equipment, including spectrometers, chromatographs, mass spectrometers and other hardware equipment and corresponding software.
3) Tektronix Test Equipment: Tektronix is a company that focuses on real-time test and measurement, providing a range of test equipment in semiconductor equipment, including hardware equipment such as digital oscilloscopes, logic analyzers, protocol analyzers, and corresponding software.
4) National Instruments (NI) Test Equipment: National Instruments is a company focusing on virtual instrument technology, providing a range of test equipment in semiconductor equipment, including hardware equipment such as data acquisition cards, multi-function instrument modules, and corresponding software.
3.3 Test the function and function of the equipment
(1) Test the function and function of the hardware:The main function of the test hardware is to provide the electrical signals and physical environment required for the test, such as voltage, current, temperature, pressure, etc. At the same time, the test hardware also needs to accurately control and measure the chip under test to ensure the accuracy and reliability of the test results.
(2) Test the function and function of the softwareThe main function of the test software is to control the test hardware and execute the test program. The test software needs to cooperate with the test hardware, and realize the automatic testing and control of the chip under test through the control of the test hardware. At the same time, the test software also needs to process and analyze the test data to find product problems and improvement directions.
(3) The function and function of the data processing and analysis system:The main function of the data processing and analysis system is to process and analyze the test data, and convert the test results into readable data reports and charts. The data processing and analysis system also needs to perform statistics and analysis of the test results to find problems in the product and the direction of improvement. In addition, data processing and analysis systems need to provide data storage and management functions to ensure data reliability and traceability.
(4) The function and function of the control system:The main function of the control system is to control the operation and operation of the test equipment, including mechanical motion system, temperature control system, pressure control system, etc. The control system needs to cooperate with the test software to achieve automated testing and control. In addition, the control system needs to provide safety protection functions to ensure the safety of equipment and personnel.
(5) The function and function of the auxiliary system:The main function of the auxiliary system is to support the operation and operation of the test equipment, including cooling system, cleaning system, lighting system, etc. Auxiliary systems need to be configured and used according to the needs of the equipment to ensure the stability and reliability of the equipment.