There are some common problems that may be encountered during the use of insulating epoxy encapsulants. These problems can affect the performance of the glue and the stability of the electronics. The following are common problems in the use of insulating epoxy potting compound and how to deal with them:
Problem 1: The glue does not cure or does not cure completely.
Possible causes: the ratio of curing agent is incorrect, the temperature is not enough, the time is insufficient, etc.
Solution: Check whether the curing agent ratio is correct to ensure that the curing is carried out at the appropriate temperature and time.
Problem 2: The viscosity of the glue is unstable.
Possible causes: improper storage conditions, temperature changes, expiration, etc.
Solution: Make sure the glue is stored at the right temperature and humidity conditions, away from direct sunlight. Check if the glue has expired and buy a new one if necessary.
Problem 3: Bubbles appear in the glue.
Possible causes: uneven mixing, too fast potting, undrained air bubbles, etc.
Treatment: Stir fully when mixing glue to ensure uniformity. When potting, control the speed to ensure that the air bubbles are discharged. If bubbles have already appeared, vacuum treatment or heat treatment can be carried out to help the bubbles expel out.
Problem 4: The adhesive line cracks or falls off.
Possible causes: improper surface treatment of the substrate, too thin adhesive layer, incompatibility between glue and substrate, etc.
Treatment: Ensure that the surface of the substrate is clean and free of oil, and apply it according to the thickness recommended by the manufacturer. If not, try changing to a different brand or type of glue.
Problem 5: Glue color change.
Possible causes: prolonged exposure to sunlight, high storage temperature, deterioration of glue, etc.
Solution: Avoid direct sunlight and store in a cool place. Check the condition of the glue regularly and consider replacing it with a new one if there is an odor or color change.
In conclusion, proper use and storage of insulating epoxy encapsulant is key to avoiding common problems. Understanding and addressing these issues can help improve the stability and reliability of electronic devices.