Selection and form analysis of PCB circuit board lamination process

Mondo Technology Updated on 2024-02-18

In the field of electronic manufacturing, PCB (Printed Circuit Board) circuit board is the key carrier for connecting electronic components. In order to ensure that electronic components can work stably, the production of PCB circuit boards needs to go through multiple processes, one of the important steps is the lamination process. Lamination, or lamination, is the process of bonding insulating materials, copper foils, and prepregs into a single unit at a certain temperature and pressure. This process has a critical impact on the performance of the board. Next, let's take a look at the selection and form of PCB circuit board lamination process.

First, the selection of pressing process

Selection of presses

The pressing machine is the main equipment for the pressing process, and its selection directly affects the quality and efficiency of the pressing. Common pressing machines on the market include vacuum pressing machines, automatic pressing machines and manual pressing machines. The automatic pressing machine is favored by large production lines because of its high efficiency and stability; Smaller labs or small batches may prefer a lower-cost manual press.

Determination of pressing parameters

Lamination parameters include temperature, pressure, and time, all of which need to be precisely controlled based on material properties and sheet thickness. Excessive temperature may cause excessive flow of resin, affecting the mechanical strength of the circuit board; If the temperature is too low, the resin may not flow sufficiently, affecting the adhesion between the layers. The pressure also needs to be moderate to ensure that the resin is evenly distributed and air bubbles are excluded.

Material selection

The materials of PCB circuit boards mainly include FR-4, CEM-1 and other epoxy resin composite materials. Different substrates have different thermal stability, electrical properties and mechanical strength, so the selection needs to be determined according to the application environment and performance requirements of electronic products.

Second, the diversity of pressing forms

Single-sided pressing

Single-sided lamination refers to the lamination process of a circuit board with only one copper foil. This form of press-fit is relatively simple and is often used in simple electronic devices.

Double-sided lamination

Double-sided lamination involves a circuit board with copper foil on both sides, which requires precise alignment of the pattern on both sides during the lamination process to ensure the connectivity of the circuit.

Multi-layer board lamination

For complex electronic devices, multi-layer lamination technology may be required. This technique bonds multiple double-layer or single-layer boards together to form a multi-layer board structure by repeating the lamination process several times.

Blind and buried via technology

In the production of some high-density interconnect (HDI) PCBs, blind and buried via technology is essential. This technique allows for the formation of a hidden conductive path inside the circuit board, greatly increasing the flexibility and density of the circuit design.

To sum up, the lamination process of PCB circuit board is a complex and delicate process, which involves the selection of equipment, the control of parameters and the matching of materials. Different electronic products have different requirements for PCB circuit boards, so it is necessary to choose the appropriate pressing process and form according to the specific situation in actual operation. Through careful process control, we can obtain high-performance, high-reliability PCB circuit boards, which provide a solid foundation for the development of the electronics world.

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