Kunpeng Project
SK hynix and TSMC have partnered to jointly promote HBM4 technology and support AI chip innovation.
Recently, SK hynix, a world-renowned semiconductor company, and TSMC jointly announced a new type of AI chip partnership, which is a new type of "all-in-one strategy". This strategic alliance will further strengthen the collaboration between the two parties in AI chips and promote the development of international cutting-edge technologies such as the 6th generation HBM (HBM4).
Under this alliance, SK hynix and TSMC will work closely together on the development of HBM4 chips. HBM (High-Bandwidth Memory) is a storage method for high-performance computing, which has a larger bandwidth advantage than existing DRAM storage, and has broad application prospects in artificial intelligence, high-performance computing, and image computing. HBM4 is a new generation of HBM, which is expected to make breakthroughs in storage bandwidth and energy efficiency, laying a solid foundation for the development of AI chips.
According to the agreement, TSMC may assume the production process of HBM4 chips. TSMC is one of the world's most influential semiconductor manufacturers, with a lot of experience and strong scientific and technological strength in chip production. After reaching an agreement with SK hynix, TSMC hopes to use its experience in chip production to improve production efficiency and reduce costs, thereby promoting the commercial promotion of this technology.
SK hynix is a world-renowned semiconductor memory manufacturer with strong technological capabilities in the fields of artificial intelligence and HBM. If an agreement is reached with TSMC, SK hynix can leverage its strong R&D and market strength to promote the rapid growth of the HBM4 process, thereby enhancing its competitive advantage in the field of AI chips.
SK hynix and TSMC have formed a alliance"One team strategy"The alliance will promote the in-depth cooperation between the two sides in artificial intelligence chips and promote the development and innovation of the world's artificial intelligence chip industry.