What are the precautions for SMD magnetic inductors to avoid bending? Is there any solution? The answer is yes.
Chip magnetic inductors have a wide range of use, but they are most prone to bending and cracking in PCB boards during use, and multilayer ceramic capacitors are characterized by being able to withstand large compressive stress, but their bending resistance is relatively poor. Any operation that may result in bending deformation during device assembly can cause the device to crack. Let's take a look at the precautions for chip capacitors to avoid bending.
How to solve the problem encountered in the use of SMD magnetic inductor?
Common problems are easy to appear in the process of circuit board operation, circulation of people, equipment, gravity and other factors; Through-hole component insertion; Circuit testing, single board splitting; circuit board mounting; riveting of circuit board points; Screw mounting, etc. This type of crack typically originates at the metallized ends of the upper and lower parts of the device and propagates along a 45-angle direction inside the device. This type of defect is also the type of defect that actually occurs the most.
Magnetic chip inductance.
Mechanical stress factors caused by SMD magnetic inductors?
The test probe causes the PCB to bend.
Exceeds the bending of the PCB and the rupture impact of the PCB.
Nozzle placement (placement nozzle pressure is too large and the downward pressure distance is too deep) and centering jaw fixation cause impact.
Excessive amount of solder (e.g. a common pad at one end).
2. Principle of mechanical stress cracks:
The ceramic body of a chip capacitor is a brittle material. If the PCB board is bent, it will be subjected to a certain amount of mechanical stress. When the stress exceeds the strength of the porcelain body of the chip capacitor, bending cracks can occur. As a result, cracks caused by this bending only appear after welding.
After understanding the precautions for magnetic inductors to avoid bending, I hope to pay attention to the fact that the power inductor is small but the pressure resistance is not so strong. Attention needs to be paid to what should be noted, and some protective measures should be taken to change the protection.
For the precautions to avoid bending of SMD magnetic inductors, it is necessary to consider the layout and position of the inductors in the design stage of the PCB board, and try to place the inductors at the edge of the PCB board to avoid placing a large number of inductors in the center area of the board. In addition, the mechanical structure and assembly process of the PCB board need to be reasonably designed to ensure that excessive pressure or bending force is not applied to the inductor during the assembly process.
During the production process, there are a number of auxiliary measures that can be employed to reduce the risk of inductor bending. For example, stiffeners can be used on the back of the PCB board to increase the stiffness and bending resistance of the board. In addition, special jigs or fixtures can be used to hold the PCB board in place to reduce the effect of mechanical stress on the inductance generated during the production process.
For inductors that have already bent, there are a number of repairs that can be taken to reduce their effects. For example, a bent inductor can be clamped using a clamp or fixture to return it to its original shape. In addition, special welding techniques, such as the use of lower welding temperatures or special welding methods, can also be used to reduce the influence of mechanical stress generated during the welding process on the inductance.
In general, in order to avoid the bending of SMD magnetic inductors, it is necessary to consider the layout and position of the inductors in the design stage, and reasonably design the mechanical structure and assembly process of the PCB board. During the production process, auxiliary measures can be employed to reduce the risk of inductor bending. For inductors that have already bent, repair measures can be taken to reduce their effects. Through these measures, the risk of bending of SMD magnetic inductors can be effectively reduced, and its reliability and stability can be improved.