Huawei has just released a new chip, and ASML has news: TSMC's hegemony is being challenged!
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More information: As soon as Huawei released a new chip, ASML broke the news: TSMC's hegemony is being challenged!
Since Biden of the United States changed the chip rules and suppressed Chinese companies such as Huawei, the world semiconductor chip market has experienced an unprecedented reshuffle. Huawei, China's high-tech giant, has withstood strong pressure and has not given up on its own research and development of chips. Some time ago, Huawei launched a series of self-developed chips one after another, demonstrating its strong strength in the chip field. At the same time, global lithography machine giant ASML has also announced new plans, further intensifying the competitive situation in the chip market. Faced with this situation, TSMC's hegemony seems to be in jeopardy.
Huawei's self-developed chips.
In the face of U.S. sanctions, Huawei has firmly embarked on the path of independent research and development of chips. Some time ago, Huawei launched new self-developed chips such as the Kirin 9000s processor, the Hongqi 900 smart TV chip, and the Kirin 9610A on-board chip. The launch of these chips not only demonstrates Huawei's strength in the field of self-developed chips, but also injects new vitality into the development of China's semiconductor industry.
However, Huawei's path to developing its own chips has not been smooth. Due to US sanctions, it is difficult for Huawei to obtain equipment for the production of high-end chips. This has forced Huawei to look for other avenues, such as domestic production, to produce and package its own advanced chips.
ASML's new initiative.
In the face of changes and competition in the global chip market, lithography giant ASML has announced new plans. According to a press release from ASML, the company expects to begin production of 10 state-of-the-art NA EUV lithography machines in 2024. These lithography machines will be able to produce 2-nanometer chips and are one of the most advanced chip processing technologies available today.
However, this ASML program does not mean that all manufacturers will have equal access to these advanced lithography machines. According to reports, Intel Corporation in the United States has pre-ordered six NA EUV lithography machines, while other chipmaking giants such as TSMC and Samsung can only share the remaining four. This situation has undoubtedly intensified the competitive situation in the global chip market.
TSMC's dominance is in question.
TSMC has long held a leading position in the global chip manufacturing market. However, with the changes in the global technology landscape and the intensification of competition, TSMC's supremacy seems to be facing unprecedented challenges.
On the one hand, with the rise of Chinese high-tech companies such as Huawei, the global tablet market landscape is changing. The progress and strength of Chinese companies in the field of independent research and development of tablet computers have brought a lot of competitive pressure to international tablet giants such as TSMC.
On the other hand, American companies such as Intel have been strengthening their position in the field of chip manufacturing. Intel has already pre-ordered ASML's NA EUV lithography machine and plans to produce 2nm chips at its own factory. This undoubtedly poses a threat to TSMC's position in the global high-end chip market.
In addition, TSMC is also facing competitive pressure from other international competitors such as Samsung. In the global chip market, Samsung is also a force to be reckoned with. In the field of memory chips, Samsung already has strong strength, and at the same time, it is actively preparing to develop and produce advanced processing technologies.
In short, with the rise of Huawei's self-developed chips, the implementation of ASML's new plan, and the changes in the global technology landscape, TSMC's dominance in the global chip market seems to be facing unprecedented challenges. In the face of challenges, TSMC must continue to innovate and improve its own strength and ability to respond to market changes in order to continue to maintain its leading position. At the same time, for the global semiconductor industry, the coexistence of competition and cooperation will be the norm in the future. Only by strengthening cooperation and common development can technology companies in various countries avoid falling into development bottlenecks.