Dutch semiconductor equipment leader ASML on Friday showed the latest chip generation High NA EUV equipment, worth up to 3500 million euros, the weight is equivalent to two A320 Airbuses.
According to Reuters and Bloomberg, the latest High-NA EUV device can print circuits on 8nm-thick semiconductors, which is 1 smaller than the previous generation7 times. The thinner the circuit, the more transistors can be mounted on the chip, and the processing speed and memory are better.
Monique Mols, a spokesperson for ASML, said during a tour of the headquarters that the installation of the 150,000-kilogram system would require 250 containers, 250 engineers, and would take six months to complete.
Peter Wennink, CEO of ASML, said that AI requires a lot of computing power and data storage, which would not be possible without ASML, which is also a major driver of the company's business.
At present, Intel has placed an order and shipped it to Intel's Oregon factory at the end of December last year, and it is expected to be used to manufacture chips by the end of 2025. ASML received a record number of orders for EUV devices last quarter, with TSMC, Intel, and Samsung all optimistic about the technology. ASML has been selling low-NA EUV devices since 2018 for a price of 1700 million euros.
Header image**: ASML).