The working principle of high-frequency DC plating power supply is as follows:
Input Stage: First, AC power is fed into the power supply unit.
Rectifier filtering stage: The input AC power supply is rectified by the rectifier to convert the AC power into direct current. At the same time, the clutter and interference in the power supply are removed through the filter circuit to ensure the stability and purity of the power supply.
High-frequency inverter stage: The rectified and filtered direct current is fed into the high-frequency inverter. The high-frequency inverter converts direct current into high-frequency alternating current through the switching action of the high-frequency switch tube. The frequency of high-frequency alternating current is usually between 10kHz and 50kHz, which makes the power supply smaller, lighter, and more efficient.
Output rectification and filtering stage: The high-frequency alternating current output by the high-frequency inverter is rectified again through the rectifier to convert the high-frequency alternating current into direct current. Then, the clutter and interference are further removed by the filter circuit, and a smooth DC output is obtained.
Control stage: The control circuit is responsible for monitoring the working state of the power supply and adjusting the output of the power supply as needed. For example, the control circuit can achieve constant control of the output current to ensure the stability of the plating process. In addition, the control circuit can also realize protection functions such as over-current, over-voltage, and over-temperature to ensure the safe operation of the power supply.
Eventually, after the above steps, the high-frequency DC plating power supply converts the incoming alternating current into stable, high-frequency direct current, providing the required power for the plating process. High-frequency DC electroplating power supply has the advantages of small size, light weight, high efficiency and good stability, and is widely used in various electroplating processes.