On February 21, Liyang Microelectronics, a wholly-owned subsidiary of Liyang Chip, officially opened.
The Liyangxin project has been selected as a major construction project in Dongguan City in 2023, and has successfully completed the commissioning of a series of technical processes such as wafer thinning, polishing, laser grooving, and laser hidden cutting in the near future, and will enter the mass production stage.
In terms of wafer thinning and polishing technology, Sunny can provide the industry's highest standard of ultra-thin wafer thinning processing technology services. A fully automatic grinding and polishing machine is used to integrate back grinding and stress removal, and it is possible to stably perform thinning machining with a thickness of 25 m or less.
In terms of laser slotting technology, Sunny uses non-contact laser processing to remove the metal wiring layer on the surface of the wafer cutting lane, supports the slotting and full cutting process of the wafer, the laser slotting width is continuously adjustable from 20 to 120 m, and the slotting depth can reach 26-30 m, which has good geometry and depth stability, and is suitable for the cutting lane to have polymetal, thick gold, low-K, passivation layer and other situations. The laser grooving process technology solves the quality problems of abnormal edge chipping, metal curling and metal residue caused by conventional blade cutting, as well as the rupture of the front passivation layer, so as to avoid the reliability risk of chip products.
Sunny has the industry's leading non-destructive internal laser hidden cutting technology. **Dicing is a dicing method in which the laser is focused on the inside of the wafer to form a modified layer, and the wafer is divided into die (die die) with wafer expansion. This technology can be applied to the processing of wafers with a minimum of 20 m dicing lane, (the standard dicing lane is reduced from 60 m to 20 m), improving the utilization of wafer chip area, increasing the number of gross dies, and is expected to reduce chip cost by up to 30%. Laser hidden cutting technology can replace many technical problems that cannot be solved by traditional diamond water cutting process.
In addition, laser hidden cutting is a dry environmental protection process, and the advantages of non-destructive internal cutting in processing quality are as follows: (1) it can inhibit the generation of processing debris, resist fouling, prevent the front and back of the chip from collapsing and side collapsing, and effectively avoid damage to the chip line; (2) The protection of the front passivation layer is more intact, and the bonding problems such as pollution, particle adhesion, and PAD oxidation can be effectively solved, so as to ensure the stable quality and yield of customer chip products, and it is the best solution to improve the quality of high-reliability chips, including special chips.
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