Market size and prospect forecast of electronic adhesive industry segment application fields in 2024

The market size and prospect of the electronic adhesive industry segment application field**

Electronic adhesive is one of the important product forms of electronic polymer materials, which can be used as packaging materials, thermal conductive materials, electromagnetic shielding materials, photoresists and other applications.

, chip-level and board-level packaging of high-end electronic adhesives need to be broken through

With the development of the electronics industry and technological progress, the requirements for electronic adhesives in the downstream field are also getting higher and higher. Worldwide, many countries are carrying out relevant research and technological innovation to actively promote the technological development of electronic adhesives, and the technical level of the electronic adhesive industry is constantly improving.

Electronic adhesives mainly include adhesive products used in chip-scale packaging, PCB board-level packaging, system-level assembly and other fields. Compared with system-level assembly, chip-level and PCB-scale packaging often have higher requirements for the sizing accuracy, modulus control, and damp and heat resistance of electronic adhesive products, so the technical added value of related products is usually higher. Specifically, the continuous high degree of integration, miniaturization, multi-functionalization, and high power of electronic products has increased the demand for materials for chip-level and PCB board level packaging. In order to achieve a high degree of integration, the diversified development of chip packaging methods makes the corresponding electronic adhesive products have the characteristics of many varieties, high quality requirements, strict requirements for environmental cleanliness, fast product upgrading, and large R&D investment. At the same time, highly integrated components after chip-scale packaging not only need to be securely assembled on the PCB, but also need to maintain good electrical and thermal conductivity when working.

At present, domestic enterprises in the low-end application points have the strength to compete with international manufacturers, can provide electronic adhesives that meet the requirements of the standard and have a high cost performance, but high-end fields such as chip scale packaging and PCB board level packaging are still mainly dominated by foreign companies such as Henkel, Fuller, Dow Chemical Technology and market, and domestic downstream enterprises still rely on imports. In recent years, with the support of national policies, the R&D level and production level of China's electronic adhesive enterprises have been continuously improved, and the high-end development trend of the electronic adhesive industry has emerged. Industry-leading enterprises are gradually strengthening R&D to fill the technical gap, accelerate the entry into the field of high-end electronic adhesives, and successfully introduce the downstream well-known brand customer chain.

Electronic adhesives are interdependent and promote the development of downstream technologies and processes, and have the characteristics of high degree of customization and fast iteration

Because electronic adhesives play an important role in the performance improvement and function realization of electronic components and electronic products, and directly affect the product function, product yield, production cost, production efficiency and so on of downstream customers, the technology and process development of electronic adhesives and the electronics industry are interdependent and mutually reinforcing. On the one hand, the performance and characteristics of electronic adhesives are closely related to their application scenarios, different electronic products have different application requirements, electronic adhesive companies need to fully understand the downstream needs on the premise of comprehensive consideration of the electrical properties, chemical properties, physical properties, optical properties, thermal properties, process properties and other aspects of electronic adhesive products, to develop electronic adhesive formulations that meet customer needs. On the other hand, the rapid upgrading of electronic products and the rapid iteration of related technologies and processes have continuously put forward new requirements for the performance and function of electronic adhesives, so electronic adhesives also need to be continuously iterated according to the technology and process development of downstream industries.

The market size of the global electronic adhesive industry is the first

As the upstream material of the electronics industry, the market of electronic adhesives is closely related to the development of the electronics industry. In recent years, with the trend of informatization, intelligence, and new energy, intelligent terminals, new energy vehicles, photovoltaics, semiconductors, communications and other electronic industry-related fields have achieved rapid development, and the electronic adhesive market as the upstream field of the electronics industry has also shown a steady growth trend. On the one hand, the end products continue to be iteratively upgraded in the direction of integration, lightweight, and multi-function, which has brought stable market demand for electronic adhesives; On the other hand, the technological development and rapid volume of products such as new energy vehicles, advanced packaging of photovoltaic power generation systems, AR VR, 5G and 6G have brought broad growth space for the electronic adhesive market.

With the continuous advancement of emerging technologies in downstream industries such as the Internet of Things, artificial intelligence, automotive intelligence and new energy, advanced packaging, and 5G and 6G, the market size of electronic adhesives will continue to grow in the future. It is expected to exceed $9.2 billion in 2030, with a compound annual growth rate of 88%。

Global Electronic Adhesive Market Size**

The Asia-Pacific region is the world's largest electronic adhesive market, among which, China, as one of the world's most important producers of electronic information products, occupies more than half of the share of the Asia-Pacific region, and is one of the world's major electronic adhesive producers and consumers. China's electronic adhesive industry market is above 10 billion yuan.

International electronic adhesive manufacturers dominate the global market, the localization rate of China's electronic adhesive market needs to be improved, and there is huge room for domestic substitution in high-end fields. Enterprises in developed countries started earlier in the field of electronic adhesives, and have achieved certain first-mover advantages in terms of technology, brand and scale, and the companies currently in the forefront of the industry are mainly from abroad, including Henkel, H.B. Fuller, Dow Chemical and other companies. Some internationally renowned electronic adhesive companies have also invested in the production and sales of adhesives in China to seize the domestic market. According to the article released by the China Adhesive and Adhesive Tape Industry Association, the localization rate of electronic adhesives in China is less than 50%, especially in the field of high-end electronic adhesives such as semiconductor packaging and PCB board level packaging applications, which are still dominated by foreign companies, and it is expected that the localization rate of electronic adhesives in the field of semiconductor packaging will not exceed 10%.

, the development of electronic adhesive subdivision application fields and **

1) Intelligent terminal field.

Electronic adhesives are widely used in smart terminal products such as mobile phones, personal computers, tablets, TWS headsets, smart watches, and AR VR devices. Compared with mechanical connection methods such as screws and buckles, electronic adhesives have the advantages of being suitable for the connection of small gaps, uniform stress distribution, a wide range of connectable materials, sealing and waterproofing, and can be used as functional materials, and the application of electronic terminal products is increasing. At the same time, the shipments of traditional smart terminal products such as smartphones, personal computers and tablets have been relatively stable and good for a long time in the past two years, and the shipments of emerging smart terminal products such as TWS headsets, smart watches, and ARVR headsets have grown rapidly, providing a stable market space and great growth potential for smart terminal electronic adhesives.

1) Smartphones, PCs and tablets.

Affected by macroeconomic conditions, global shipments of mobile phones, PCs and tablets declined in 2022 and 2023, and are expected to gradually recover thereafter. In 2027, shipments of mobile phones, PCs and tablets will rebound to 137.1 billion units, 28.9 billion units and 13.6 billion units.

2) Wearables.

In recent years, wearable devices represented by TWS earphones and smart watches have developed rapidly, and with the continuous innovation and expansion of wearable device product categories and the continuous enrichment of functions, the market demand is expected to continue to grow steadily. It is expected that the global shipments of hearables and smart watches will grow to 38.2 billion units and 21.1 billion units, with an average annual compound growth rate of about 447% and 731%。

3) AR VR headset.

AR VR headsets are an emerging hotspot in the smart terminal industry, and with the continuous maturity of technologies in related fields, in 2023, a number of technology giants will release AR VR headset products, and the AR VR market is expected to usher in an accelerated volume cycle.

2) New energy field.

In recent years, green and sustainable development has gradually become the consensus of the international community. At present, more than 120 countries and regions around the world have put forward the goal of "carbon neutrality", among which the United States, the European Union, the United Kingdom, Japan and other economies plan to achieve "carbon neutrality" by 2050, and China plans to achieve "carbon neutrality" by 2060. Energy transition is a necessary condition for achieving "carbon neutrality", and increasing the research and development of new energy technologies and adjusting the energy structure are important paths for energy transition. Among them, new energy vehicles are strongly supported by industrial policies due to their environmental protection and ecological sustainability, and their sales continue to grow. As an important clean and renewable energy source, photovoltaic power generation can effectively save energy resources, and with the development of technology, its economic benefits have been continuously improved, and the installed capacity has expanded year by year. As an important material in the production and manufacturing process of new energy vehicles and photovoltaic power generation systems, electronic adhesives will also benefit from the rapid development of the new energy industry.

1) New energy vehicles.

The "three-electric system" of new energy vehicles provides a broad incremental space for the electronic adhesive market. In order to ensure the stability and safety of new energy vehicles in the process of high-speed driving in complex road conditions, the "three-electric system" of new energy vehicles requires electronic adhesives for bonding, sealing, heat conduction, protection, etc. At the same time, with the development trend of large-scale modularization and non-modularization of power batteries, power battery packaging materials are one of the key materials to replace traditional structural parts to achieve lightweight and high reliability of power batteries, which is expected to promote the continuous increase of the amount of glue used in bicycles. Electronic adhesives, as important bonding, sealing, thermal conductivity and protective materials in the manufacturing process of automotive electronics, are expected to grow in market size as the value of automotive electronics increases.

2) Photovoltaic power generation system.

Electronic adhesives can be used for the thermal conductivity and packaging of inverters in photovoltaic power generation systems, and are key materials to ensure the continuous and stable operation of photovoltaic power generation systems, and the market size is expected to benefit from the rapid growth of the photovoltaic industry.

3) Semiconductor field.

Semiconductors play a key role in the development of the electronic information industry, not only the core component of today's electronic products, but also an important underlying product for the future development direction of artificial intelligence, Internet of Things, cloud computing, industrial Internet, etc., and is the embodiment of the core competitiveness of national science and technology. Semiconductor manufacturing mainly includes chip design, product round manufacturing, packaging and testing and other processes, electronic adhesives are used in product round manufacturing and packaging processes, especially in the packaging process, electronic adhesives are important semiconductor packaging materials.

As an important supporting material for integrated circuits, the packaging materials represented by electronic adhesives have been monopolized by foreign leading enterprises for a long time because of their high barriers and difficult processes, and domestic enterprises have long relied on imports. The international semiconductor industry's implementation of technology and restrictions on China has exacerbated the uncertainty of China's integrated circuit industry, and it is imperative to realize the independent development of core technologies and the whole industrial chain, and the localization of upstream key raw materials and other supporting industries. The state's support for the upgrading of the semiconductor industry drives Chinese semiconductor material companies to accelerate the speed of research and development and realize the domestic substitution of packaging materials.

With the development of packaging technology, electronic adhesives are becoming more and more widely used. At this stage, the R&D cycle of Pinyuan manufacturing process is lengthened, and the continuous shrinking of the process leads to the transistor density approaching the limit, resulting in problems such as leakage, heat generation and serious power consumption. In addition, since the IC process node is already at a high level, each increase comes with a non-linear increase in cost. At present, the R&D progress of the integrated circuit process line width of the world's leading wafer manufacturing companies has lagged behind the theoretical value of Moore's law. Advanced packaging technology can improve product integration and functional diversification through wafer-level packaging and system-in-package without relying solely on chip process technology to achieve breakthroughs, meet the needs of terminal applications for lightweight, thin, low-power, and high-performance chips, while greatly reducing chip costs.

In the field of semiconductor packaging, electronic adhesives can be used as die bonding materials, thermal interface materials, underfill materials, photoresists for wafer-level packaging, etc.

4) Communications.

Electronic adhesives can be applied to the electromagnetic shielding, thermal conductivity, bonding, protection and protection of electronic components in communication base stations and data centers, benefiting from the development of digital economy and artificial intelligence, the rapid development of new infrastructure represented by communication base stations and data centers is expected to promote the continuous growth of the electronic adhesive market in the communication field. According to the Ministry of Industry and Information Technology's "14th Five-Year Plan for the Development of the Information and Communication Industry", from 2020 to 2025, the number of 5G base stations per 10,000 people is expected to increase from 5 to 26, and the computing power of data centers will increase from 9 per second0000000000000000000000000000000000000000000000000000 billion floating-point operations, with a compound annual growth rate of about 27%. As an important component of communication base stations and data centers, global optical modules are in the stage of rapid market development.

For more industry information, please refer to PwC ConsultingyearsElectronic adhesivesSpecial Report on Industry Segment Analysis and Investment ProspectsAt the same time, PwC Consulting also provides services such as industrial research reports, industrial chain consulting, project feasibility reports, specialized and special new small giant certifications, market share reports, 14th Five-Year Plan, post-project evaluation reports, BP business plans, industrial maps, industrial planning, blue and national manufacturing single champion enterprise certification, IPO fundraising feasibility study, IPO working paper consulting and other services.

Table of Contents

Chapter 1 Analysis of the Macroeconomic Environment

Section 1 Global Macroeconomic Analysis.

1. Overview of global macroeconomic operation in 2023.

2. Global macroeconomic trends in 2024**.

Section 2 Analysis of China's Macroeconomic Environment.

1. Overview of China's macroeconomic operation from 2019 to 2023.

2. China's macroeconomic trends in 2024**.

Section 3 Analysis of the social environment of the electronic adhesive industry.

Section 4 Analysis of the political and legal environment of the electronic adhesive industry.

1. Analysis of industry management system.

Second, the relevant development plan of the industry.

3. Interpretation of major industrial policies.

Section 5 Analysis of the technical environment of the electronic adhesive industry.

1. Analysis of the level of technological development.

2. Analysis of technological innovation trends.

Chapter 2 Analysis of the Development of the International Electronic Adhesive Industry

Section 1 Analysis of the development status of the international electronic adhesive industry.

1. Overview of the development of the international electronic adhesive industry.

2. Analysis of the economic benefits of the electronic adhesive industry in major countries.

3. Analysis of the development trend of the international electronic adhesive industry from 2024 to 2030.

Section 2 Development status and experience of electronic adhesive industry in major countries and regions.

1. Analysis of the development of the electronic adhesive industry in the United States.

Industry scale in 2023.

Industry outlook for 2030.

2. Analysis of the development of the European electronic adhesive industry.

Industry scale in 2023.

Industry outlook for 2030.

3. Analysis of the development of electronic adhesive industry in Japan and South Korea.

Industry scale in 2023.

Industry outlook for 2030.

4. Analysis of the development of electronic adhesive industry in other countries and regions from 2019 to 2023.

5. Summary of experience in the development of foreign electronic adhesive industry.

Chapter 3 Supply and Demand Analysis of China's Electronic Adhesive Market from 2019 to 2023

Section 1 2019-2023 Electronic Adhesive Capacity Analysis.

1. China's electronic adhesive production capacity and growth rate from 2019 to 2023.

2. China's electronic adhesive production capacity from 2024 to 2030.

3. Analysis of China's electronic adhesive capacity utilization rate from 2019 to 2023.

Section 2 Analysis of electronic adhesive production from 2019 to 2023.

1. China's electronic adhesive production and growth rate from 2019 to 2023.

2. China's electronic adhesive output from 2024 to 2030**.

Section 3 2019-2023 Electronic Adhesive Market Demand Analysis.

1. The market demand and growth rate of China's electronic adhesives from 2019 to 2023.

2. 2024-2030 China's electronic adhesive market demand**.

Chapter 4 Analysis of the structure of China's electronic adhesive industry chain

Section 1 Structure of China's electronic adhesive industry chain.

First, the industrial chain overview.

2. Features. Section 2 Evolution Trend of China's Electronic Adhesive Industry Chain.

1. Life cycle analysis of the industrial chain.

2. Analysis of the value flow of the industrial chain.

3. Evolution path and trend.

Section 3 Competition Analysis of China's Electronic Adhesive Industry Chain.

Chapter 5 2019-2023 Electronic Adhesive Industry Chain Analysis

Section 1 Analysis of the upstream operation of the electronic adhesive industry from 2019 to 2023.

First, the upstream of the industry introduction.

2. Analysis of the upstream development status of the industry.

3. Analysis of the influence of the upstream of the industry on the electronic adhesive industry.

Section 2 Analysis of the downstream operation of the electronic adhesive industry from 2019 to 2023.

First, the downstream of the industry introduction.

Second, the proportion of downstream demand in the industry.

3. Analysis of the downstream development status of the industry.

aMarket analysis of electronic adhesives