It's so ruthless! Xiang Ligang TSMC continues to upgrade its chip manufacturing process
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The wafer process is always improving. In the past few years, the mainstream process was 7nm and 5nm, and now it has entered 3nm, and in 2025, TSMC, Samsung, etc. will also start mass production of 2nm process.
With such an important breakthrough in the chip manufacturing process, as well as the desire for success from customers, and the continuous revision of chip production laws in the United States, more processes are being examined. However, can the progress in the manufacturing process really bring about qualitative changes? Can EUV lithography be applied to 7nm and lower processes?
In this regard, Xiang Ligang, a well-known communications expert, said that TSMC's continuous improvement of the chip manufacturing process is an amazing **!
High-quality fighting skills.
7nm is a breakthrough technology, 6nm and 5nm are high-end technologies, and 10nm and 14nm are advanced technologies. In order to manufacture wafers of 7 nm or less, most manufacturers require EUV lithography machines from ASML.
On top of that, the United States has a great demand for EUV lithography machines, while China does not yet have EUV lithography machines, and it is difficult to manufacture chips below 7 nm. Over time, many people have come to the conclusion that EUV lithography machines can make high-end chips, which has become an unwritten rule.
This is not a strange thing, a good device can greatly improve the yield of chips. Therefore, when TSMC and Samsung began to develop the 2 nm process, the current EUV lithography technology could no longer meet the demand, and more advanced equipment was needed to manufacture it.
To this end, ASML has released a new generation of high-NA EUV lithography machine with a cost of up to 27 billion yuan and a weight of 150 tons, which costs up to 27 billion yuan and is not yet marketable. However, there is still a shortage of high-resolution NA EUV lithography equipment, and 10-20 orders have been received.
Of course, China will not have a high-NA EUV lithography machine, does this mean that we have no chance to compete with high-end processes? Xiang Ligang's words made him wake up like a dream.
Xiang Ligang debunked**.
Xiang Ligang, a well-known communications expert, pointed out that TSMC's further improvement of the 7 nm and later process will rely on the most expensive EUV lithography machine, which is regarded as a trend and may become a means to restrict China's development.
Mr. Jiang also said that TSMC's process update is actually a farce, and China will mass produce 5nm chips, which will lead to China not being able to achieve this goal without EUV lithography.
Judging from Xiang Ligang's speech, TSMC's 7 nm lithography machine is simply deceiving, and any 5nm and 3nm technologies are all deceiving.
Xiang Ligang was referring to TSMC, although TSMC has been developing 5nm and 3nm chips, but deep ultraviolet lithography technology can fully meet the needs of the market. Is this ** exposed by Xiang Ligang true?
There is even news that the Huawei Kirin 9000 S chip will be the main product of the Mate60 series and become a hot-selling product. The Kirin 9000 S chip is domestically manufactured and does not use American technology or extreme ultraviolet lithography process. However, even the Kirin 9000 S chip is not inferior to TSMC's 5nm process, or even surpassed.
Perhaps it won't be long before China can make a significant contribution using existing technologies.
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