Intel has announced that it will launch 14 nanometer chips, marking the competition of 2 nanometer chips has begun. To regain leadership in semiconductor chip manufacturing, Intel has unveiled a new technology roadmap that includes a state-of-the-art 14A chip manufacturing process plan.
Intel CEO Pat Gelsinger announced the 14A technology at the Intel Foundry Direct Connect conference and said it is equivalent to 14 nanometer technology. This is Intel's first detailed disclosure of its post-2025 semiconductor roadmap and expects the 14A node to start production around 2027.
At the meeting, Gelsinger also introduced the latest progress in the foundry model, including system-level foundry (Intel foundry), which aims to meet the demand for computing power in the AI era. This model divides Intel into two parts: Intel Product, which is responsible for product design, and Intel Foundry, which is responsible for contract manufacturing, and although it belongs to the same company, it is financially accounted for independently. This model aims to provide equal foundry services to internal and external customers.
In addition, Intel announced the welcome of new customers and ecosystem partners on the 18a process node, including Microsoft. Microsoft plans to use the Intel 18A process node in one of the chips it designs. At the same time, ecosystem partners such as Synopsys, Cadence, Siemens and Ansys have validated their tools, design flows and IP portfolios for Intel's advanced packaging and 18A process technologies, enabling foundry customers to accelerate advanced silicon designs based on Intel's 18A process node, the industry's first back-side power solution.