CICC Research Institute, Minsheng**, Tianfeng**, Mr. New Materials and online public information[Insight Thermal Management].It is learned that recently, OpenAI released the "Wensheng**" toolsoraIn just a few days, it has become popular all over the Internet. Not only that, on February 21, the ** State-owned Assets Supervision and Administration Commission was held"AI-empowered industry renewal".**Enterprise Artificial Intelligence Special Promotion Meeting. The meeting emphasized that enterprises should put the development of artificial intelligence in the overall work of overall planning, further promote industrial renewal, and accelerate the layout and development of intelligent industries. It is necessary to consolidate the basic foundation for development, concentrate the main resources on the most needed and advantageous areas, accelerate the construction of a number of intelligent computing centers, further deepen open cooperation, and better play the role of cross-central enterprise collaborative innovation platform. Carry out AI+ special actions, strengthen demand traction, accelerate the empowerment of key industries, build a number of industrial multi-modal high-quality datasets, and create a large model from infrastructure, algorithm tools, intelligent platforms to solutions to empower the industrial ecology. AI is already unstoppable, and the industrial chain will be a super market! The AI computing infrastructure is mainly based on servers, and the main structure can be divided into chips, storage devices, switches, optical modules, cooling systems, power supplies and other hardware, which covers multiple categories of raw materials such as substrates, packaging, and resins. According to CICC Technology's estimates, the increase in servers brought by the demand for AI computing power from 2023 to 2025 may reach 250,000, a considerable increase. In this article, we will make a brief inventory of the relevant materials covered in the computing hardware, and if there are any errors or omissions, please correct them.
Chips
AI chips are mainly divided into three categories: GPUs (graphics processing units), FPGAs (field-programmable gate arrays), and ASICs (application-specific integrated circuits). Its upstream essence is still the well-known semiconductor industry chain, which mainly involves matrix materials, manufacturing and packaging materials.
Specifically, the matrix materials include silicon, silicon dioxide, gallium arsenide, gallium nitride, silicon carbide, and diamond. Manufacturing and encapsulation materials include electronic special gases, photomasks, polishing slurries, polishing pads, photoresists and supporting reagents, doping materials, insulating materials (alumina, silicon nitride, etc.), diode materials (germanium disulfide, indium gallium phosphide, etc.), sputtering targets, etc. Among them, diamond is regarded as the ultimate semiconductor material. In October 2023, the American company Diamond Foundry (DF) created the world's first single-crystal diamond wafer (Diamond Wafer), which can realize the direct atomization of diamonds to integrated circuit wafers, and the wafer thickness can reach Angstrom-level precision. The company's diamond wafer products can accelerate AI & cloud computing by 3 times, power electronic components by 6 times, and wireless transmission speed by 3 times. According to the company's plan, after 2023, they plan to install a single crystal diamond behind each chip for heat dissipation, and after 2033, promote the application of diamond materials in the semiconductor industry, such as substrate materials used to make transistors or other semiconductor components. This involves a key photoresist material, PSPI (photosensitive polyimide), which is currently produced by HDM, Toray, Fujifilm, etc. 
Source: DF's official website.
pcb
Pulled by an AI server, in a printed circuit board (PCB).High-frequency and high-speed copper clad laminatesThe demand is expected to grow in large quantities, especially for ultra-low loss copper clad laminates above the M6 level. PCB is one of the core components of the computing system, according to Prismask, it is expected that China's PCB output value will reach 54.6 billion US dollars in 2026, and its core componentsCopper clad laminate (CCL).Raw materials include electronic copper foil, fiberglass cloth, special resins, etc.
This is one of themSpecialty electronic resin materialsAs the key, at present, it is mainly based on modified epoxy electronic resins (such as biphenyl epoxy resin, bisphenol cyclopentadiene epoxy resin, mar epoxy resin, etc.). In addition, new resins for high-frequency and high-speed copper clad laminates such as polyphenylene ether (PPO), hydrocarbon, bismaleimide (BMI), and PTFE are also developing rapidly.
From the point of view of the marketThe enterprises in the copper clad laminate industry chain mainly include Japanese companies such as Panasonic, Showa Denko, and ZTE Chemical, as well as Taiwanese companies such as Taiyao and Lianmao. Upstream resins are represented by overseas companies such as Asahi Kasei, Solvay, Hearst, and Caton. In terms of domestic related enterprises, the main ones are Shengquan Group, Dongcai Technology, Shengyi Technology, Nanya New Materials, Huazheng New Materials, Hongchang Electronics and so on. Among them, Tozai Technology recently said that the company has built a production capacity of 3,700 tons of bismaleimide resin. The material plays the role of interconnection conduction, insulation and support, and realizes the high-frequency and high-speed SORA operation, and has been applied to Open AI and NVIDIA AI servers on a large scale, and indirectly entered the mainstream industrial chain systems such as NVIDIA, Huawei, Apple, and Intel. At present, the material accounts for 100% of the consumption of a leading enterprise. 
Source: Internet.
Optical transceivers
As the core of information transmission, optical modules focus on optical chips for speed and stability. At present, optical chips are mainly made of silicon, indium phosphide, gallium arsenide, lithium niobate, etc., and are moving to 400g 800g 1The trend of 6t high rate is developing.
At present, the main manufacturers of gallium arsenide are Freiberger, Sumitomo, Beijing Tongmei, etc.; The main manufacturers of indium phosphide are IQE, IntelliEpi, etc.; The main producers of lithium niobate are Sumitomo, Shin-Etsu, etc., and some of the above-mentioned substrate materials are also actively deployed by SMIC and the Chinese Academy of Sciences.
In addition to optical chips, due to the demand for heat dissipation due to high-speed transmission, the application of metal matrix composites with high thermal conductivity and low expansion such as tungsten copper alloy and diamond copper composites in the field of optical chip packaging is also growing.
Chip thermal management
In addition to the metal-based packaging materials mentioned in the above-mentioned optical chips, chip thermal management mainly involves air-cooled water-cooled related heat dissipation materials, such as:Liquid-cooled fluorinated liquid(hydrofluoroether, perfluoroamine, perfluoropolyether, etc.), as well as substrates, interface materials, and thermal conductive materials related to underfill materials, such as thermally conductive silicone oil, thermally conductive gaskets, graphite films, thermally conductive gels, thermally conductive phase change materials, etc. Among them, the most widely used thermal conductive fillers can be divided into metal particles, oxides, nitrides (boron nitride, aluminum nitride, etc.) and carbon materials.
From the perspective of the market structure,The overseas related suppliers of liquid-cooled fluorinated liquid mainly include 3M, Solvay, Asahi Glass, etc., and domestic related enterprises include Juhua Co., Ltd., Chunjun New Materials, etc. Overseas related suppliers of thermal interface materials mainly include Laird, Chomerics, Bergquist, Fujipoly, Sekisui, Dowcorning, Shinetsu and Honeywell, etc., and domestic related enterprises include Wanhua Chemical, Capchem, Juhua Co., Ltd., Runhe Materials, Zhongshi Technology, Debang Technology, Comet New Materials, Shenzhen Bohn, etc. 
"The 2nd Thermal Management Materials Technology Expo" (ithermexpo2024).Will beNovember 13-15, 2024InShenzhen World Exhibition & Convention CenterIt will efficiently present a one-stop value docking platform for the thermal management industry chain to meet and promote the exchange, cooperation and win-win development of all units in the thermal management industry. Innovative materials, instruments, equipment, design and technology, solutions, application scenarios, patented technologies and other convergence links and presentations will be an important part of the expo; Thematic forums related to science, materials, technology and engineering in the field of thermal management, roundtable closed-door, thermal management hackathon, innovation and entrepreneurship project display, new product release, demand docking and other activities will also be presented at the same time, especially the innovative technologies and achievements of scientific research units will also get the opportunity to transfer from laboratory docking to the market.