A few days ago, Chengdu Aerospace Bomu Electronic Technology Co., Ltd. (hereinafter referred to as Aerospace Bomu Company) was officially registered and established in Jinniu District.
Chengdu Aerospace Bomu Electronic Technology Co., Ltd. is located in Area B, No. 666, Golden Phoenix Avenue, Jinniu High-tech Industrial Park, Chengdu, Sichuan Province, with a registered capital of 290 million yuan.
The scope of business includes general projects: engineering and technical research and experimental development; integrated circuit chip and product manufacturing; integrated circuit manufacturing; integrated circuit design; integrated circuit chip design and services; integrated circuit sales; sales of integrated circuit chips and products; semiconductor discrete device manufacturing; sales of semiconductor discrete devices; radar and ancillary equipment manufacturing; communication equipment manufacturing; IoT device manufacturing; optoelectronic device manufacturing; sales of optoelectronic devices; manufacturing of electronic components; wholesale of electronic components; sales of electronic products; research and development of special electronic materials; manufacturing of special electronic materials; sales of special electronic materials; research and development of new material technology; new material technology promotion services; technical services, technology development, technical consultation, technology exchange, technology transfer, technology promotion; software development; software sales; information technology consulting services; technology import and export; Import and export of goods. (Except for projects subject to approval in accordance with the law, independently carry out business activities with a business license in accordance with the law).
It is reported that the Aerospace Bomu Company was established by 23 United Science and Industry Group Asset Companies and 25 Institutes. Focusing on the needs of equipment technology, the company gathers the group's superior resources, builds the production and manufacturing capacity of RF microsystems, builds the integration capability of the whole industry chain in the mainstream of the industry, and forms an open platform for the basic research and development of microelectronics of the Science and Industry Group to ensure that the core of key technologies is in hand. (Pan Huanhuan text).