Hotspot Engine Project Like, Follow, **You don't get lost in the digital field! At a groundbreaking ceremony held on January 30, MediaTek started the construction of the Hsinchu high-speed rail office building, which is expected to be completed in 2027. This marks a new milestone for the tech giant. Chairman Tsai Mingjie and CEO Tsai Lixing presented the company's latest trends in product and technological innovation at the ceremony.
Cai expressed MediaTek's unwavering confidence in the wave of AI integration in mobile phones and proudly mentioned their acclaimed flagship chip, Dimensity 9300. In order to welcome a bigger breakthrough, Cai Lixing announced that MediaTek plans to launch Dimensity 9400 in the fourth quarter of this year.
The Dimensity 9400 chip is unique in that it uses TSMC's innovative 3nm process. This is a groundbreaking move that allows MediaTek to make significant progress in terms of performance and power efficiency. The chip will be joined by an upgraded version of the Cortex-X5 core, which is more powerful than the Cortex-X4 in the Dimensity 9300. The LPDDR5T memory is seamlessly integrated with local AI computing needs.
The advanced AI performance of the Dimensity 9400 chip will open new doors for larger-scale AI models to run directly on the device, surpassing the massive 33 billion parameter large language models that the Dimensity 9300 can achieve. This breakthrough will lead to more powerful features and a smoother user experience that people are looking forward to.
Through close cooperation with TSMC, MediaTek has consolidated its key position in the development of 3nm chips. TSMC's 3nm process is one of the world's most advanced semiconductor technologies, delivering an 18% performance improvement at the same power consumption and a 32% reduction in power consumption at the same frequency performance. In addition, the process enables a staggering 60% increase in logic density over the previous 5nm process. This is truly amazing!
The collaboration between MediaTek and TSMC is already beginning to bear fruit, with they announcing a joint effort to develop 3-nanometer chips, which will begin mass production later this year. This further strengthens MediaTek's leadership position in the evolution of semiconductor technology, leaving other competitors in the dust. That's why MediaTek is the top brand with "core" on top of "core"!