Keysight Technologies Successfully Completes Autotalks 5G New Radio IoV System on Chip Validation

Mondo Technology Updated on 2024-02-27

The solution provides 3GPP Version 16 SideLink standard physical layer verification testing.

Ability to perform rigorous physical layer testing to validate system-on-chip designs and ensure reliable, noise-robust communications.

SideLink is one of the features of 3GPP REL-16, which enables direct communication between two devices, and is an important guarantee for the next generation of 5G NR V2X Day 2 use cases to improve road safety. In the case of Day 2 use case for collaborative perception, two vehicles using 5G NR V2X technology can communicate with each other and share information detected by the vehicle's sensors. The SideLink function can be implemented through physical layer communication. This communication method defines the relevant signals and channels, and can achieve robust and stable multi-functional communication. To ensure reliable, noise-resistant communication between vehicles, SoC developers need to perform rigorous physical layer testing during the design and verification phases.

autotalksVice President of R&Damos freundRepresentation"We strongly believe that a reliable validation process is essential for the successful development of this advanced technology. "By partnering with Keysight, we are able to validate the baseband and RF characteristics of third-generation V2X chips, paving the way for advanced security use cases in the automotive industry." ”

Vice President and General Manager of Keysight's Automotive & Energy Solutions Groupthomas goetzlRepresentation"SideLink is a key enabling technology for 5G V2X Day 2 use cases, which has the potential to significantly improve safety and create a better overall driving experience. Our easy-to-use PathW**e NR V2X signal analysis and generation software suite provides Autotalks with 3GPP-compliant measurements and signals, saving valuable R&D resources and time while accelerating validation of the Tekton3 SoC. ”

Liu Liqing).

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