Microelectronic adhesive seal element porosity bubble X-ray detection equipment XDR-AZ350 type.
With the continuous development of science and technology, microelectronic adhesive sealing components are more and more widely used in various fields, and the problem of porosity bubbles has always been one of the important factors affecting their quality and reliability. Therefore, it is necessary to perform porosity bubble detection on microelectronic encapsulation components. In this article, we will introduce the XDR-AZ350 X-ray inspection equipment designed for porosity bubble detection of microelectronic encapsulated components.
1. Equipment overview.
XDR-AZ350 Microelectronic Adhesive Sealing Element Porosity Bubble X-ray Inspection Equipment is used for non-destructive testing equipment designed in the microelectronic packaging industry. The equipment uses X-ray technology to quickly and accurately detect porosity bubbles in microelectronic sealing elements, providing strong support for product quality control and reliability evaluation.
Equipment features: High-precision detection: The XDR-AZ350 equipment uses a high-energy X-ray source and a high-resolution detector to detect porosal bubbles as small as a few microns to ensure the high quality of the product.
Rapid detection: The equipment adopts high-speed X-ray scanning technology, which can complete the detection of a large number of samples in a short time, which effectively improves the production efficiency.
High reliability: The XDR-AZ350 equipment adopts a stable and reliable hardware and software system, which has a high degree of anti-interference ability and stability, which can ensure long-term stable operation.
Easy maintenance: The structure and design of the equipment fully consider the needs of maintenance and maintenance, which is convenient for users to carry out daily maintenance and maintenance work.
3. Scope of application.
XDR-AZ1600, XDR-AZ350 microelectronic sealing components porosity bubble X-ray detection equipment is suitable for porosity bubble detection of various microelectronic adhesive sealing components, other microelectronic packaging fields: can be used for pore bubble detection in various other microelectronic packaging fields to meet the needs of different industries.