The preparation of transparent conductive films has always been an important topic in scientific research and industrial applications. Embedded metal grid transparent conductive film is a preparation method that has attracted much attention in recent years. This kind of film combines the conductivity of the metal grid with the light transmission of the transparent material, which not only has high conductivity, but also maintains good transparency, so it has a wide range of application prospects in solar cells, touch screens, displays and other fields.
The preparation method of embedded metal grid-type transparent conductive film is mainly divided into two steps: the first is to prepare the metal grid, and the second is to embed the metal grid into the transparent substrate. To prepare the metal grid, it is necessary to select suitable metal materials, such as silver, copper, etc., and form a metal grid structure of a certain shape and size on the substrate through photolithography, evaporation, chemical corrosion and other processes. Embedding the metal mesh into the transparent substrate requires hot pressing or vacuum adsorption of the metal film and the transparent substrate to ensure that the metal mesh has a good bond with the substrate.
Among them, the preparation of metal mesh is a key link in the whole preparation process. The structural parameters of the metal mesh have an important influence on the properties of transparent conductive films. In general, there is a compromise between the conductivity and transparency of metal meshes, that is, the better the conductivity, the worse the transparency. Therefore, it is necessary to accurately control the line width, spacing, thickness and other parameters of the metal mesh to achieve a balance between conductivity and transparency. In addition, the cost, stability and other aspects of the metal mesh also need to be considered to meet the needs of different application scenarios.
In addition, in the process of embedding the metal mesh into the transparent substrate, it is necessary to consider the way in which the metal mesh is combined with the substrate. Common bonding methods include hot pressing, vacuum adsorption, bonding, etc. Different bonding methods affect the conductivity and transparency of the final film, so it is necessary to choose the appropriate bonding method on a case-by-case basis. At the same time, in order to ensure the bonding strength of the metal mesh and the substrate, the bonding quality can also be improved by surface treatment and adding intermediate media.
In general, the preparation methods of transparent conductive films with embedded metal grids are constantly developing and improving. By reasonably designing the structural parameters of the metal grid, selecting the appropriate preparation process and bonding method, thin film materials with excellent conductivity and transparency can be obtained, which provides strong support for the application of various electronic devices. In the future, with the continuous development of materials science and engineering technology, the transparent conductive film embedded with metal grid will surely show broader application prospects in many fields.