Magnesium oxide for thermal conductivity is used for thermally conductive silica gel sheets, thermal conductive resins PA6 and PPS. Through different particle size ratios, the thermal conductivity can reach 5W mk。1800 2000 High temperature firing and unique reaction conditions improve the disadvantages of high moisture absorption of magnesium oxide. After surface treatment, it has better contact with resin. It is lightweight, highly insulating, and thermally conductive, and can be filled in large quantities. Compared with spherical alumina, it has higher thermal conductivity and better processing performance. After surface treatment, it has better contact with resin. It is lightweight, highly insulating, and thermally conductive, and can be filled in large quantities. It is one of the excellent materials of thermally conductive rubber, thermally conductive plastic and thermally conductive adhesive.
The process of magnesium sulfate pyrolysis to magnesium oxide realizes the energy saving, environmental protection and resource utilization of by-products in the whole process. Magnesium oxide is used instead of ammonia water in ammonium sulfite pulping. Magnesium oxide is used as the alkaline buffer, and the various indexes of the slurry can reach a level similar to that of the ammonia method. Using magnesium oxide as a buffer, the pulp is easily bleached, which can promote the delignification of the steaming process, reduce pollutant emissions, help protect the environment, and reduce costs.
Magnesium oxide for thermal conductivity is used to improve thermal conductivity by adding resin composite materials to thermoplastic resins such as PPS, LCP, and PA. Thermal interface materials (heat sinks, grease, etc.). A large amount of thermosetting resins such as silicon and acrylic are added to improve heat dissipation. Semiconductor sealing materials are generally used as sealing materials for the protection, moisture-proof, and insulating purposes of semiconductor devices.