With the rapid development of semiconductor wastewater treatment technology and the increase in consumer demand, the fluorine-containing wastewater discharged from semiconductor factories has increased dramatically, and the types of complexed ions produced have increased. The wastewater treated in each process is different, and the wastewater from the corrosive substrate is mainly hydrofluoric acid, which has the largest discharge. In order to prevent the pollution and ecological damage caused by such wastewater, efforts must be made to reduce the fluoride content of wastewater.
There are many types of wastewater from semiconductor plants, especially hydrofluoric acid wastewater containing organic solvents (used for degreasing and cleaning substrates) or hydrofluoric acid (used for substrate corrosion), as well as various compounds. Although most of the organic solvents get **, some are still mixed into the wastewater. Fluoride wastewater has a higher fluoride content, while fluoride wastewater has a lower fluoride content. Therefore, wastewater with high and low fluoride concentrations can be treated separately or mixed together.
CPS Semiconductor Wastewater Treatment Features include a high ability to withstand shock loads and an average residence time of more than 6 hours using the contact oxidation process. Semiconductor wastewater treatment has the function of nitrogen and phosphorus removal, and the equipment structure can be adjusted to realize the treatment of industrial, domestic and municipal sewage. Most of the fillers in the contact oxidation tank are soft fillers, which have the characteristics of light weight, high strength, stable physical and chemical properties, large specific surface area, strong biofilm adhesion, high sewage contact efficiency, and many biofilms.