With the continuous progress of science and technology, a variety of new materials emerge in an endless stream, among which silicon nitride ceramics, as a high-performance ceramic material, has excellent high temperature resistance, wear resistance, corrosion resistance and other characteristics, and is widely used in various fields. In the valve industry, high-hardness silicon nitride ceramic ball spool, as a new material, has also been widely used.
Applications of silicon nitride in semiconductors:
Silicon nitride composites are an excellent high-performance radome material for missiles with excellent high temperature resistance, low dielectric and creep resistance. The application of this material enables the missile to maintain excellent performance in extreme environments. The silicon nitride film is the core part of this composite material. Its high heat resistance, low dielectric constant and excellent creep resistance enable it to maintain stable performance in various harsh environments, providing a guarantee for the precise guidance of missiles.
In addition, silicon nitride ceramic balls are also an excellent material. Its characteristics of high hardness, high wear resistance, corrosion resistance, high temperature resistance, light weight, high processing accuracy, self-lubrication and insulation, etc., make it the first choice for ceramic bearings and hybrid ceramic ball bearings. The advent of this material has greatly improved the performance and service life of these bearings. The high-hardness silicon nitride ceramic ball spool is also widely used in pharmaceutical, papermaking, printing and dyeing, food and other industries. In these industries, the high-hardness silicon nitride ceramic ball cartridge is an ideal choice of valve material due to its excellent performance and wide range of applications.
Physical properties of silicon nitride ceramics:
Si3N4 is a special compound whose structure is dominated by covalent bonds, which gives it strong strength and directionality. However, there are some defects in its structure that require a lot of energy to form and migrate, so its defect diffusion coefficient is relatively low. This also means that the sintering process of Si3N4 is difficult and its structure is not dense enough. In order to improve its performance, a small amount of oxide sintering additives is usually added to make it denser by liquid-phase sintering. It is worth noting that Si3N4 has a very high melting point of about 1900.
In the research process, nanotechnology was introduced into the thermal shock test of silicon nitride ceramic specimens. With this method, the correlation between the residual compressive strength and the temperature difference of thermal shock resistance can be measured at a certain room temperature to evaluate its thermal shock resistance. This approach provides a deeper understanding of the characteristics and performance of Si3N4, laying the foundation for further application and research.
Silicon nitride ceramic chemical properties:
Silicon nitride reacts with hydrofluoric acid to form silicon tetrafluoride and ammonium fluoride. The reaction equation is: Si3N4 + 12HF = 3SIF4 + 4NH3. In this process, hydrofluoric acid reacts with silicon nitride to form ammonium fluoride, an ammonium salt, and silicon tetrafluoride gas.