10 Processes and 10 Technical Considerations for FPC Flexible Circuit Boards.
Embossing: Printing graphics and text on flexible circuit boards.
Chemical etching: A flexible circuit board is etched using chemical reagents to form metal circuits.
Opening: Open the holes on the flexible circuit board as required.
Splitting: A large flexible circuit board is cut into multiple smaller flexible circuit boards.
Lamination: Bonding flexible circuit boards of different materials together.
Punching: The flexible circuit board is pressed into the desired shape through a die and die.
Surface coating: A protective coating is applied to the surface of a flexible circuit board.
Soldering: Soldering components on a flexible circuit board.
Plating: Plating is performed on flexible circuit boards to enhance electrical conductivity.
Cleaning: Clean the flexible circuit board of impurities and residues to make it clean and tidy.
10 technical considerations.
Choosing the right substrate: The choice of substrate for flexible circuit boards has a direct impact on the performance of the circuit board.
Reasonable setting of routes: The layout and width of the lines need to be selected according to actual needs.
Pay attention to corrosion prevention: During the chemical etching process, corrosion prevention measures are essential to avoid loss and quality problems.
Accurate positioning of holes: The positioning accuracy of holes has a great impact on the circuit board after production, which needs to be paid attention to.
Uniform bonding: When bonding flexible circuit boards of different materials, it is necessary to ensure uniform coverage and clamping to avoid quality problems.
Punching process mastery: Punching needs to master the pressure and mold temperature and other parameters to ensure the consistency of the product.
Uniform coating: The uniformity of the coating plays a key role in the protection of the circuit board and requires special attention.
Welding skills: When welding, it is necessary to master the welding time and temperature and other parameters to avoid damage to the components or poor welding.
Electroplating mastery: In the electroplating process, it is necessary to master the parameters such as voltage and current to ensure the quality of electroplating.
Thorough cleaning: Special attention needs to be paid to the thoroughness and dryness of cleaning to avoid contamination and loss.